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Thick Film Ceramic Substrates

The manufacturing technology of thick-film ICs is based on the use of screen printing. Ceramic thick film substrates are mainly used for thick film hybrid IC manufacturing. The essence of the technology lies in the application of pastes on a ceramic substrate through a mesh stencil - specially prepared compositions of functional, binder and organic materials, followed by their firing into the substrate to impart desired physical properties. Pastes, depending on the purpose, are called conductive, resistive or dielectric. Metals and alloys (silver, gold, palladium, platinum, radium and their compounds) are used as functional materials for conductive pastes, noble metals and combinations of metals with oxides (thallium oxide, palladium oxide, rhenium oxide, etc.) for dielectric - ceramic materials with a high dielectric constant, most often based on BaTiO3. Functional materials are introduced into the paste in the form of small particles with a maximum size of not more than 5 microns. The particle size distribution and shape have a strong influence on the physical and electrical properties of the films. The permanent binder keeps the functional material particles in point contact during firing and assists in anchoring the film to the substrate. Low-melting glass is used as a binding material. Organic materials (liquids based on water, alcohols, turpentine, resins with other additives) are introduced into the paste as a binder and to give it the fluidity required for screen printing. The manufacture of pastes involves the preparation of components and mixing them in the appropriate proportion until a homogeneous structure is obtained, in order to ensure screen printing, the pastes must have a certain viscosity and surface tension. The application of the pasty substrate is carried out using special installations, consisting of the following main units: a stencil holder, a substrate holder, a squeegee, a squeegee holder and a drive for moving the squeegee. The required configuration of the pastes applied to the substrate is obtained by forcing the pastes through the stencil while moving the squeegee. In thick film substrate technology, two types of stencils are used: all-metal and mesh. All-metal stencils are a metal foil with a thickness equal to the thickness of the applied paste; the desired pattern is created by etching the foil. Mesh stencils as a basis have a wire mesh made of stainless steel or nylon, evenly stretched on the frame. The wire diameter and mesh sizes can be different depending on the requirements of the technology. In practice, grids with a window size of 120 m and a wire diameter of 40 m are most widely used. The pattern on the stencil is formed using photolithography in a layer of photosensitive emulsion applied to the grid. Screen printing using a mesh stencil is called mesh printing.

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Meizhou Exhibition Electronic Technology Co.,Ltd

, CN Manufacturer

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

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Noritake Co., Limited

, JP Manufacturer

Grinding and polishing tools, coolants, electronic pastes for thick film technology, thick film substrates.

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CoorsTek, Inc.

, US Manufacturer

High-Purity Advanced Ceramics for Semi Wafer Processing. Clean, Durable Ceramic Components for OEM Semiconductor Processing Equipment. Thick-Film Electronic Substrates, Thin-Film Electronic Substrates, RF & Microwave.

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Oasis Materials

, US Manufacturer

AlN ceramic thermal heaters, ceramic and metallized ceramic substrates, LTCC and AlN multilayer ceramic packages.

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Micro-Precision Technologies Inc

, US Manufacturer

Manufacturer of Hybrid Integrated Circuits (HIC), Multichip Modules (MCM), custom semiconductors and high-precision thick film substrates.

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SERMA Microelectronics

, FR Manufacturer, Service Company

Hi-Rel OSAT company, LTCC and HTCC ceramic substrates

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ECOCERA Optronics Co., Ltd

, TW Manufacturer

manufacturing direct copper ceramic (DPC) circuit board such as LEDs Al2O3/AlN fine ceramic substrates , Flesh light module DPC , IR/UV , lighting ,Laser and Automotive used DPC substrate and sub-mount.

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Advanced Substrate

, US Custom Manufacturer

Manufacturer of thick and thin film substrates. Materials such as alumina, beryllia, aluminum nitride, glass and silicon wafer substrates are available. Markets served include space, medical, military and semiconductor industries.

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MINI-SYSTEMS, INC

, US Manufacturer, Custom Manufacturer

Manufacturer of precision passive components, hybrids, and packages.

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Complete Hermetics Ltd

, US Manufacturer, Custom Manufacturer

Manufacturer of custom hermetic packages, glass-to-metal and ceramic-to-metal seals, feedthrough products.

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