MPT manufactures high-quality metalized thick film ceramic substrates, Hybrid Integrated Circuits, Multichip Modules and customer semiconductors. Other micro-electronic assembly and testing services including Die Attach/Wire bonding, MEMs assembly, custom semiconductor packaging, functional and environmental testing for microcircuits and standalone component testing. Thick film capabilities include multi-layers of conductors, as well as super fine line/spacing up to 5 mils (0.005"), via through, via filled and plated. MPT has clean areas of Class 100 for precap and Class 10,000 for assembly.
