Manufacturing Services or Consulting

Innovative packaging technology. TEG substrate design, manufacturing know-how, implementation of verification service which are necessary for flip-chip process development

Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications

Contamination control mats and flooring

Waste gas abatement and wastewater treatment solutions

Taping and reeling packaging of surface mount devices

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

POU Abatement System, RTO (Regenerative Thermal Oxidizer), IES (Ion Exchange System)

Transfer Module, EFEM, Aligner, LPM, Robot, Intelligent robot

EFEM, Atmospheric Robot, Transfer Module, Vacuum Robot

ROBOTS for semiconductor industry. Automation equipment in semiconductor, LCD, OLED, LED.

Korea Safety Certification, Risk Evaluation, Safety Policy Consulting

Reliability, Reliability Test, Quality Test, Failure Analysis, Analysis, R&D, Test, Life Test

OSAT. Semiconductor packaging and testing service.

OSAT, semiconductor packaging and testing. Test : Memory, SoC, CIS, RF, PMIC (Wafer and Package Test)

Nanoimprint lithography (NIL) tools, resists, masks, and processes for a variety of NIL including thermal and photo-curable NIL, as well as direct imprinting of materials.

PACKAGE ASSEMBLY, BALL- WEDGE- RIBBON BONDING FLIP CHIP BONDING, TEST AND DESIGN SERVICES

MEMS foundry

SiGe:C BiCMOS foundry, special integrated RF modules and integrated silicon photonics with >60GHz bandwidth photodiodes. IP cores

Superconductor integrated circuits (ICs)