Manufacturing Services or Consulting

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

POU Abatement System, RTO (Regenerative Thermal Oxidizer), IES (Ion Exchange System)

Transfer Module, EFEM, Aligner, LPM, Robot, Intelligent robot

EFEM, Atmospheric Robot, Transfer Module, Vacuum Robot

ROBOTS for semiconductor industry. Automation equipment in semiconductor, LCD, OLED, LED.

Korea Safety Certification, Risk Evaluation, Safety Policy Consulting

Reliability, Reliability Test, Quality Test, Failure Analysis, Analysis, R&D, Test, Life Test

OSAT. Semiconductor packaging and testing service.

OSAT, semiconductor packaging and testing. Test : Memory, SoC, CIS, RF, PMIC (Wafer and Package Test)

Nanoimprint lithography (NIL) tools, resists, masks, and processes for a variety of NIL including thermal and photo-curable NIL, as well as direct imprinting of materials.

PACKAGE ASSEMBLY, BALL- WEDGE- RIBBON BONDING FLIP CHIP BONDING, TEST AND DESIGN SERVICES

MEMS foundry

SiGe:C BiCMOS foundry, special integrated RF modules and integrated silicon photonics with >60GHz bandwidth photodiodes. IP cores

Superconductor integrated circuits (ICs)

program management and customized solutions for high-complexity products with low to medium volume production. ASIC design, CMOS and MEMS foundry support

Provider of product engineering and semiconductor design services.

Engineering outsourcing and consulting services for the fabless semiconductor industry, specializing in technology, product & test engineering, productization processes, reliability, failure analysis and supply chain.

Engineering Service Provider with a cutting edge focus on the development and design of ASICs, SoCs, FPGAs, Embedded Software and discrete Systems.

RF High Reliability Space Products, Test Engineering Development services, Test, package assembly, device qualification, and product reliability testing, tape and reel services. Gain Blocks, GaN Power Amplifiers, MCMs And Hybrids.