Manufacturing Services or Consulting

Engineering Services, Cost effective Solution

Looking to build a campus of compound semiconductors. Ottawa is world renowned for its research facility ( CPFC - NRC).

AmTECH Microelectronics is a custom microelectronics assembly and advanced packaging services company located in Silicon Valley, CA. The company specializes in prototype to low-medium volume production on-shore manufacturing.

USsemi Inc. is composed of a team from US and Taiwan with over 15 years of combined experience in advanced packaging and advanced substrate technologies. We offer comprehensive solutions that include materials, equipment, and customized services.

DBC, AMB, DPC, AlON, Al2O3, ZTA, Si3N4, AlN, Solder- and Sintermaterials, OSAT

KLA-Tencor Legacy tool parts and service; new surface scanners for wafers and masks / 0/15um particle detection

OMedasemi is a innovative company located in Shanghai,we maily provide Nanofabrication service and diverse advanced wafer (Sic,GaN,Ga2O3,Diamond,SOI,SICOI,LNOI,LTOI,GaNoI )

nanoASIC specialize in providing top-quality IC design services for a wide range of applications. Our team of experienced designers works closely with our customers to develop custom solutions that meet their unique needs.

BITSILICA is a leading Semiconductor Design Services company

Advanced photolithography technology and resolution enhancement techniques, for advanced semiconductor manufacturing. Geminatio is developing & delivering materials and infrastructure that enable low-cost IC shrink paths

Probe Stations, Probe Station Software, Probe Station Accessories, Thermal Chuck

Innovative packaging technology. TEG substrate design, manufacturing know-how, implementation of verification service which are necessary for flip-chip process development

Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications

Contamination control mats and flooring

Waste gas abatement and wastewater treatment solutions

Taping and reeling packaging of surface mount devices

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

POU Abatement System, RTO (Regenerative Thermal Oxidizer), IES (Ion Exchange System)

Transfer Module, EFEM, Aligner, LPM, Robot, Intelligent robot