Assembly

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

One stop R&D for device construction proposal, design, process proposal, prototype building, reliability testing, and volume production

Services - Process planning - Quality Control - Mechanical Design - Supply Chain Management - Materials - Parts Manufacturing

Focusing on industrial machinery and equipment, including semiconductor manufacturing equipment, we are in charge of parts processing for a set of equipment, from manufacturing to quality assurance and delivery.

Die bonding and Wire bonding Services

NEW PRODUCT INTRODUCTION, SUPPLY CHAIN MANAGEMENT, SURFACE MOUNT TECHNOLOGY, TEST SYSTEMS DEVELOPMENT, QUALITY MANAGEMENT, MANUFACTURING, ENGINEERING

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

IP and technology transfer. Flip-chip technologies include the Copper Pillar Bump, Molded Interconnect Substrate, No-Flow Underfill, and flipchip packaging methods and structures including flipchip on leadframe and substrate packages.

Vacuum Feedthrough, Quartz, Ceramics, SiFusion Silicon parts, Silicon Wafers, Process Tool Parts, Cleaning, Temescal Systems

Sintering Press - Silver Sintering/Copper Sintering and Scanning Acoustic Microscopy, Wafer Lamination.

OSAT (outsourced semiconductor assembly and test) company. Semiconductor and display panel production samples to mass production.

Manufacturer of Hybrid Integrated Circuits (HIC), Multichip Modules (MCM), custom semiconductors and high-precision thick film substrates.

Open cavity plastic packages, wafer preparation services, wafer dicing, IC and MEMS packaging.

OSAT (outsourced semiconductor assembly and test) company. SiP assembly service provider.

Hi-Rel OSAT company, LTCC and HTCC ceramic substrates

ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services

ASIC design and manufacturing services

OSAT (outsourced semiconductor assembly and test) company.

OSAT (outsourced semiconductor assembly and test) company.