Ag-Sintering / Cu-Sintering Technology
Pressure sintering (silver sintering or in the next future copper sintering too) is a die attach heat treatment process applied to a powdered material in order to give it higher strength, integrity and conductivity.
Pressure sintering is now considered the most reliable technology for power electronics packaging. The proven advantages of sintering technology are the following ones:
- Highest melting temperature >400°C
- Best thermal conductivity coefficient >150 W/(m K)
- Best electrical conductivity coefficient
- Best result on lifetime testing
Considering electronic devices continue to shrink in size and at the same time increase in power, the trend toward higher power density is fast increasing. Volume power density is a crucial consideration where space is constrained or where maximum output is needed in a fixed space. There is a constant research to reduce as much as possible the power module size with new technology generations.
Thanks to these features, pressure Ag sintering is a consolidate bonding solutions to sinter dies and clips on DBC, DBA, AMB, frames and moreover, to sinter package on heatsink.
Due to this excellent bonding performance, pressure sintering is also the perfect bonding solution for:
- Double side cooled package (high performance inverter fort new power generation of vehicles);
- Place sensor;
- Wafer lamination and wafer sintering;
AMX worldwide patented a unique sintering tool for its sintering press, the so called "Micro-Punch" able to press individually and with a dedicated pressure every single component on the substrate (thermistor, IGBT, mosfet, die, chip…).
AMX Micro Punch tool grants an even pressure and most of all definitely avoid the following high value problems that usually occur: die crack, tilting, delamination and voids.
The Micro-Punch tool has no limits in dies number and positioning, it can adapt itself to every DBC size and configuration, and can press independently the thinnest and smallest dies even if they are very close one another.
Thanks to our patented pressure sintering technology, we are also able to have the complete traceability of the total pressure applied on the dies. Key point for having a complete reliable and repeatable system.
Our experienced R&D team can support you choosing the best solution for your specific silver sintering and copper sintering applications, choosing from a wide variety of sintering presses. AMX sintering press range covers all the customers’ needs: R&D, small batches, low volume and high volume of productions.
X-Sinter P50 Series
X-Sinter P50 Series
Manual sintering press with high accuracy both in terms of pressure and temperature control.
X-Sinter P100 Series
X-Sinter P100 Series
Semi-automatic sintering press equipped with our patented micro-punch tool
X-Sinter P200X Series
X-Sinter P200X Series
Fully inline sintering press for high volume of production.
Scanning Acoustic Microscopy Technology
The InLine X-SAM is a new system designed for quality control in power electronics industries. A non-destructive inspection able to simplify the manufacturing process. Using an AMX patented system, components on the "Top side" of the substrates are preserved. Based on AMX In Line modular station, it guarantees flexibility and accuracy during the testing stage. A fully automatic inline solution customized on the client's design and requirements.
Inline X-Sam 200/300
Inline X-Sam 200/300
Full in-line SAM system to inspect the sintering result.
Testing, prototyping and researching
We offer the possibility to customers to run tests and make samples of their products with full traceability database system. We can handle the entire die-attach process (Ag-silver paste dispensing, sintering, inspection at different level and shear test).
We also handle requests of complete production process or we support customers during the prototyping phase.
We have a strong experience in the die-attach process and we can support the customers during their initial research phase.
The AMX clean room is equipped as follows:
Dispensing/Printing
Dry oven
Die Bonder
Sintering (N2 capability)
C-SAM
Bending test
Shear test
Cross section (on request)
Thermal and mechanical test (on request)
