AmTECH Microelectronics
Morgan Hill, US Manufacturer, Service Company 55-60
AmTECH Microelectronics is a custom microelectronics assembly and advanced packaging services company located in Silicon Valley, CA. The company specializes in prototype to low-medium volume production on-shore manufacturing.
USsemi Inc
Sheridan, US Service Company
USsemi Inc. is composed of a team from US and Taiwan with over 15 years of combined experience in advanced packaging and advanced substrate technologies. We offer comprehensive solutions that include materials, equipment, and customized services.
Ajin Electronics, Inc
, KR Service Company
Innovative packaging technology. TEG substrate design, manufacturing know-how, implementation of verification service which are necessary for flip-chip process development
Silitronics Inc
, US Manufacturer, Service Company
Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications
Suzhou Bopai Semiconductor Technology Co., Ltd
, CN Manufacturer
AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems
Miretech Co., Ltd
, KR Manufacturer, Service Company
PACKAGE ASSEMBLY, BALL- WEDGE- RIBBON BONDING FLIP CHIP BONDING, TEST AND DESIGN SERVICES
CONNECTEC JAPAN Corporation
, JP
One stop R&D for device construction proposal, design, process proposal, prototype building, reliability testing, and volume production
SungHan Co., Ltd
, TW Manufacturer
Semiconductor test probe card parts, components, and consumables
Lingyange Semiconductor Incorporated
, CN Manufacturer
IC design service company of Foxconn Group. SoC system integration verification design service
Shenzhen Chipchain Technologies Co., Ltd
, CN Manufacturer, Service Company
Design, R&D and sales of chips, semiconductors and integrated circuits. Specification definition, chip design, wafer tape-out, packaging/testing and etc. Products range from ASICs such as Blockchain, IoT, AI and etc to SoCs.
S&C Micro Inc
, US Service Company
Die bonding and Wire bonding Services
APRO Inc
, KR Service Company
Comprehensive test and evaluation of materials and parts and research & development.
BCM Electronics Corporation Sdn. Bhd
, MY Custom Manufacturer, Service Company
NEW PRODUCT INTRODUCTION, SUPPLY CHAIN MANAGEMENT, SURFACE MOUNT TECHNOLOGY, TEST SYSTEMS DEVELOPMENT, QUALITY MANAGEMENT, MANUFACTURING, ENGINEERING
Advanced Assembly Materials International Ltd, AAMI
, HK Manufacturer
Lead frame products and material solutions to the semiconductor packaging industry
Palomar Technologies, Inc
, US Manufacturer
automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.
EPMDI B.V
, NL Service Company
Сonsulting agency specialized in electronic packaging. Starting from the basic unit 'Chip' to a final electronic package involves innovation in materials, designs and processes. Standard and advanced packages e.g, PQFN, ACP, WLCSP, etc.
III-V Lab, France
, FR Manufacturer, Custom Manufacturer
III-V lab offers pre-commercial and customized production of III-V components or epitaxy wafers (MBE, MOVPE) for innovative products. advanced modeling to transfer to production in the field of III-V SC (GaAs, InP, GaN) and their integration on Si.
Advanpack Solutions Pte Ltd
, SG Manufacturer, Service Company
IP and technology transfer. Flip-chip technologies include the Copper Pillar Bump, Molded Interconnect Substrate, No-Flow Underfill, and flipchip packaging methods and structures including flipchip on leadframe and substrate packages.
HRL Laboratories, LLC
, US Manufacturer
GaN Power Amplifier MMIC Dice. GaN foundry and MPW services.
Amx Automatrix Srl
, IT Manufacturer
Sintering Press - Silver Sintering/Copper Sintering and Scanning Acoustic Microscopy, Wafer Lamination.