Package Mat'ls; Interconnect; Subassembly Design Svcs

Innovative packaging technology. TEG substrate design, manufacturing know-how, implementation of verification service which are necessary for flip-chip process development

Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

PACKAGE ASSEMBLY, BALL- WEDGE- RIBBON BONDING FLIP CHIP BONDING, TEST AND DESIGN SERVICES

One stop R&D for device construction proposal, design, process proposal, prototype building, reliability testing, and volume production

Semiconductor test probe card parts, components, and consumables

IC design service company of Foxconn Group. SoC system integration verification design service

Design, R&D and sales of chips, semiconductors and integrated circuits. Specification definition, chip design, wafer tape-out, packaging/testing and etc. Products range from ASICs such as Blockchain, IoT, AI and etc to SoCs.

Die bonding and Wire bonding Services

Comprehensive test and evaluation of materials and parts and research & development.

NEW PRODUCT INTRODUCTION, SUPPLY CHAIN MANAGEMENT, SURFACE MOUNT TECHNOLOGY, TEST SYSTEMS DEVELOPMENT, QUALITY MANAGEMENT, MANUFACTURING, ENGINEERING

Lead frame products and material solutions to the semiconductor packaging industry

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

Сonsulting agency specialized in electronic packaging. Starting from the basic unit 'Chip' to a final electronic package involves innovation in materials, designs and processes. Standard and advanced packages e.g, PQFN, ACP, WLCSP, etc.

III-V lab offers pre-commercial and customized production of III-V components or epitaxy wafers (MBE, MOVPE) for innovative products. advanced modeling to transfer to production in the field of III-V SC (GaAs, InP, GaN) and their integration on Si.

IP and technology transfer. Flip-chip technologies include the Copper Pillar Bump, Molded Interconnect Substrate, No-Flow Underfill, and flipchip packaging methods and structures including flipchip on leadframe and substrate packages.

GaN Power Amplifier MMIC Dice. GaN foundry and MPW services.

Sintering Press - Silver Sintering/Copper Sintering and Scanning Acoustic Microscopy, Wafer Lamination.

OSAT (outsourced semiconductor assembly and test) company. Semiconductor and display panel production samples to mass production.

Manufacturer of Hybrid Integrated Circuits (HIC), Multichip Modules (MCM), custom semiconductors and high-precision thick film substrates.