Ajin Electronics Co., Ltd., always stands with you as a reliable partner in the development of next-generation semiconductor packaging technology
We are specialized in R&D field supplying comprehensive R&D solution service as both consignment development and test-bed based on the flip-chip packaging process, which is gradually expanding its application scope in semiconductor manufacturing.
Based on our own LAB facilities with the long term of technical know-how, we provide unique test-bed service by suggesting technical ideas in Korea that allow customers to experience short-term of product development and to review the trial and errors in advance.
We suggest clients with the optimized TEG substrate design, manufacturing know-how, implementation of verification service which are necessary for flip-chip process development. We challenge and lead the development of next-generation technology generating from the demand of future industry by cooperating steadily with the materials suppliers and equipment manufacturers.
We will continually do our best to stand as a total solution provider in semiconductor packaging industry therefore our challenges will contribute to global semiconductor industry by maintaining close networks through major research institutes and overseas companies.
Process Service
Process Service/Home
Flip Bonding Biz
We support various flip-chip packaging solutions to various applications.
FCBGAFCBGA
FCBGA
EutecticEutectic
Eutectic
NCP
ACPNCP ACP
NCP
ACP
NCFNCF
NCF
ACFACF
ACF
SAPSAP
SAP
Bumping Biz
We support various bump services to materialize chip pads required for deposition flip-chip on circuit board.
Stud bumpStud bump
Stud bump
Plat bumpPlat bump
Plat bump
Cu-pillar
bumpCu-pillar bump
Cu-pillar
bump
Solder bumpSolder bump
Solder bump
RDLACF
Coming soon.
Foundry
(MEMS)Foundry
Coming soon
TEG Sub Biz
Ajin Electronics contributes to the industry by reducing the traditional development time through the activities like designing, manufacturing and sales for an experimental substrate(TEG sub) to verify the implementation of flip-chip packaging.
FCBGAFCBGA
Coming soon
Glass
SubGlass Sub
Coming soon
Ceramic
PCB SubCeramic PCB Sub
Coming soon
Rigid
PCB SubRigid PCB Sub
Coming soon
FPCB
SubFPCB Sub
Coming soon
TEG Module
