Services

manufacturer and distributor of Lumiled chips,micro chips, ceramic base led diode, CSP module, UV led, Laser led and tunabe CCT adjustable leds

BITSILICA is a leading Semiconductor Design Services company

Based on the principles of professionalism, reliability and efficiency, we provide customers with first-class semiconductor equipment transportation, logistics and customs declaration services, provide China's mid-range user market, and help the smooth de

Advanced photolithography technology and resolution enhancement techniques, for advanced semiconductor manufacturing. Geminatio is developing & delivering materials and infrastructure that enable low-cost IC shrink paths

Probe Stations, Probe Station Software, Probe Station Accessories, Thermal Chuck

Innovative packaging technology. TEG substrate design, manufacturing know-how, implementation of verification service which are necessary for flip-chip process development

Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications

Transportation. Warehousing. Customs & Compliance. One strategic partner for all your global logistics needs.

Wafer Vision / Handler, Strip Level Inspection, Tape & Reel Vision / Handler

Laser Solution, Plasma Technology , FPC Equipment, Tape and Reel

Contamination control mats and flooring

Logistics: whether it’s oversized equipment, devices or spare parts, we understand your supply chain and the care required to ship your sensitive, time-critical cargo.

Waste gas abatement and wastewater treatment solutions

Taping and reeling packaging of surface mount devices

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Wafer and Substrate Mounters (Manual and Semi-automatic), Table-top UV Irradiators, Expanders, CO2 Bubblers, Transformers and other process automation equipment

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

Interface Control Technology Module & Parts: N2 Purge Load Port System, N2 FOUP Purge System. PECVD & PCVD Module & Parts: Cassette Loader, Wafer Transfer Module, RPCVD Installation