Services

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Wafer and Substrate Mounters (Manual and Semi-automatic), Table-top UV Irradiators, Expanders, CO2 Bubblers, Transformers and other process automation equipment

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

Interface Control Technology Module & Parts: N2 Purge Load Port System, N2 FOUP Purge System. PECVD & PCVD Module & Parts: Cassette Loader, Wafer Transfer Module, RPCVD Installation

POU Abatement System, RTO (Regenerative Thermal Oxidizer), IES (Ion Exchange System)

Transfer Module, EFEM, Aligner, LPM, Robot, Intelligent robot

We buy and sell Used Semiconductor Equipment globally

Equipment Refurbish, Parts Sales, Intelligent Factory

EFEM, Atmospheric Robot, Transfer Module, Vacuum Robot

ROBOTS for semiconductor industry. Automation equipment in semiconductor, LCD, OLED, LED.

IT marketing company

Korea Safety Certification, Risk Evaluation, Safety Policy Consulting

Global Silicon Carbide wafer manufacturing innovator. 150mm and 200mm Silicon Carbide (SiC) Ingot and Wafer for RF and Power Electronics. SiC Wafer Reclaim

Thin Film Deposition Service. Advanced Films and Materials Engineering

Reliability, Reliability Test, Quality Test, Failure Analysis, Analysis, R&D, Test, Life Test

OSAT. Semiconductor packaging and testing service.

OSAT, semiconductor packaging and testing. Test : Memory, SoC, CIS, RF, PMIC (Wafer and Package Test)

Nanoimprint lithography (NIL) tools, resists, masks, and processes for a variety of NIL including thermal and photo-curable NIL, as well as direct imprinting of materials.