GaN Power Amplifier MMIC Die
Power amplifier MMICs designed for narrow and broadband applications with a focus on E and W band.
Our commercial GaN MMIC products cover DC – 40 GHz with a broadband design, narrow-band designs centered around 74, 84 & 94 GHz for E-band & W-band applications, and broadband 70 – 105 GHz designs.
HRL continues to push GaN MMIC technology to higher levels of performance with plans to add LNAs and higher power amplifiers to our commercial MMIC offerings in the future. In addition, we have the ability to custom design GaN based LNAs, power amplifiers, mixers, switches, and transceiver components for a variety of applications over different frequency ranges up to D-Band (to 170GHz). HRL is now proud to offer services to create custom multifunction modules using HRL’s MMICs and is planning to offer packaged versions of our commercial MMICs in the near future. Our proficiencies also include high-density wafer-level packaging, subsystem integration, and integrated microwave and mmW assemblies.
GaN Multi-Project Wafer (MPW) and Dedicated Wafer Services
HRL is offering Multi-Project Wafer (MPW) services for its millimeter-wave T3 GaN technology for the fabrication of high-frequency monolithic microwave integrated circuits (MMICs). This early access program, starting in 2021, is available in addition to dedicated wafer services.
With MPW services, design teams can prototype circuits at reduced cost. HRL is also offering free training for its Process Design Kit (PDK). The PDK is available in both Microwave Office and ADS.
HRL is currently taking reservations for MPW access on a first-come-first-serve basis. The design tapeout schedule is shown below.
T3 GaN Design Tapeout Deadlines
MPW4 MPW5 MPW6 MPW7
Jan. 2021 March 2021 June 2021 Aug. 2021
Items may be controlled under the provisions of U.S. Export laws including 15CFR Parts 730 – 774 (Export Administration Regulations), and may require a license to export or re-export.
For more information, please contact ganmpw[at]hrl.com.
Trusted Foundry Services
HRL is a US Department of Defense (DoD) Trusted Foundry. As one of 13 companies in the nation accredited as such, HRL provides DoD and many other federal government agencies—as well as major defense contractors—with the highest quality microelectronic foundry services for military and aerospace applications.
Our world-class 10,000-square-foot, ISO 4 clean room is the cornerstone of HRL's comprehensive microelectronics and nanotechnology capabilities, including systems for material growth, deposition, structure formation, and characterization. These capabilities continue to enable world-record component performance and novel nanoscale device structures.
We provide Trusted Foundry services and HRL Technologies™ contract research and development for compound semiconductor devices and ICs including InP HBT high-yield (>10 k) transistors and high-performance ICs with three levels of metal interconnects.
Nanofabrication & Pilot Production Manufacturing Services
HRL is making available corporate research and development services to select customers.
HRL Laboratories offers over 25 years of microfabrication experience, a fully equipped cleanroom facility, and a team of technical staff with extensive knowledge in device design, process development, and process integration. We collaborate with commercial customers to develop and prototype their emerging technologies and to fulfill pilot production manufacturing needs.
HRL-manufactured micro- and nano-electronic devices are used in systems throughout aerospace and defense industries. We've successfully executed research projects and fabricated products under commercial contracts where customers' IP were guarded with the utmost care.
Our team can transfer your manufacturing sequence to our cleanroom for a low initial cost with flexible contracting and intellectual property terms and conditions.
At 10,000 square-feet, our Level 4 cleanroom fabricates product under AS9100 (ISO9001) certified quality management system and is a DoD/NSA Trusted Foundry.
Our manufacturing capabilities and full product support include:
Epitaxial Growth
Metallization, Dielectric, ALD and CVD Thin-Film Deposition
Optical Lithography
Electron Beam Lithography
Wet/Dry Etch and Surface Treatment
Product Design
Device Modeling
IC Singulation, Assembly and Packaging
Device & Reliability Testing
