Chips

Photonic components, modules and subsystems. customizing our core photonic technology in Indium Phosphide, Gallium Arsenide or Silicon, we will be happy to provide a private label solution to support your needs.

RF High Reliability Space Products, Test Engineering Development services, Test, package assembly, device qualification, and product reliability testing, tape and reel services. Gain Blocks, GaN Power Amplifiers, MCMs And Hybrids.

PHOTOMASK HANDLING, WAFER CARRIERS, FLUID MANAGEMENT, PRECISION PARTS

Wafer box, wafer carrier, wafer cassette, wafer carrier handle, RSP (reticle SMIF pod), RSP opener, mask case, chip tray, fluoro valves, cleanroom supplies, wafer and cassette cleaning systems

vertically integrated photonics products manufacturer, was founded in 1989 to serve the laser and electro-optics research market

2.5G DFB Laser Diode Chips, 10G DFB Laser Diode Chips, 25G DFB Laser Diode Chips, PIN- PD/ MPD Chips

Membrane Box, Sticky Box, Vacuum Box, Optical Storage Box, Wafer Box, Sponge Box, Empty box, Optical Protect Bag

Jedec IC Trays, Jedec Matrix Trays, IC Chip Tray, Custom Jedec Trays, Waffle Pack Chip Trays, Electronic Components Tray, Bare Die Trays, AntiStatic Trays, Wafer Shipping Box, Gel Sticky Box, Waffle Pack Lids Clips

4-inch, 5-inch and 8-inch power semiconductor chips, as well as the analog and digital-analog IC chips

8" RF BAW Filter Production and MEMS Foundry

LGT single crystal ingot, Crystal Devices, Precision Measuring Instruments, Thin-film Submount, MEMS, Magnets, Ceramic Parts

SiC Substrates N-type, SiC Substrates SI-type, SiC Epitaxy Wafer, GaN Epitaxy on SiC, GaN Epitaxy on Si, SiC Puck (Polytype 4H), Moissanite Rough Stone

Laser and photodetector arrays for next generation infrared sensing applications.

RF MMIC products and foundry services for specialised markets, including Defence and Space, telecommmunications, automotive radar and industrial sensors.

Designer and manufacture of transfer and handling products used in the ultra-clean chemical manufacturing process of semiconductor fab manufacturing.

Micro-photonic device technologies based on III-nitride wide bandgap semiconductors, aluminum nitride (AlN), gallium nitride (GaN), indium nitride ( InN) and their alloys (AlGaN, InGaN, and InAlGaN).

TFLN Application-specific PICs. TFLN Packaged Modulators.

INPHOTEC makes available six technological platforms: Graphene Integrated Photonics, Silicon Photonics, Glass on Silicon, Hybrid Integration, LiNbO3 on Insulator (LNOI), Advanced Packaging.

Manufacture of photonic devices and their integration into RF systems. LNOI Phase modulators.