Other Chips

TFLN Application-specific PICs. TFLN Packaged Modulators.

Daisy Chain test components, zero ohm PCB jumpers and engineering evaluation kits for experimentation. We make vibration dampers to extend the life of PCB assemblies and CCGA Column Grid Array to reduce stress caused by extreme thermal CTE mismatch.

Glass wafers (microstructured, packaging), phosphor-filled glass for LED (PiG), glass frit, microfluidic glass

Micro technology based (MEMS) infrared light sources, laser gas sensors, gas flow sensors & controllers and micro-optical components used in industrial, telecom, environmental, medical and automotive applications.

Tempus Inc. is an infrared sensor manufacturing company that has its own MEMS fab.

Optoelectronic semiconductor integrated solutions, from epitaxial materials and chips manufacturing, component packaging, to LED applications. LED Chips, Silicon Sensor Chips, VCSEL chips.

Manufacturer of precision passive components, hybrids, and packages.

Manufacturer of advanced materials, MEMS chips.