Silitronics Inc

 , US Manufacturer,  Service Company
Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications

GEM Electronics (Shanghai) Co., Ltd.

 , CN Manufacturer,  Service Company
OSAT. Semiconductor packaging and testing service.

Standard Systems Inc

 , KR Distributor,  Manufacturers' Rep
IC Packaging Service, Open Cavity Packages, Test Socket, Polyimide(PI)

Hyrel Incorporated

 , US Manufacturer,  Service Company
Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.


 , KR Manufacturer
OSAT. Semiconductor packaging and testing service.

AT Semicon Co., Ltd.

 , KR Service Company
OSAT, semiconductor packaging and testing. Test : Memory, SoC, CIS, RF, PMIC (Wafer and Package Test)

Miretech Co., Ltd

 , KR Manufacturer,  Service Company

Atomica Corp

 , US Manufacturer
MEMS foundry

Crocus Nano Electronics Ltd

 , RU Manufacturer
Production of memory and sensors based on magnetic tunnel structures with 90/65 nanometers nodes on 300mm wafers.

Criteria Labs Inc

 , US Manufacturer,  Custom Manufacturer
RF High Reliability Space Products, Test Engineering Development services, Test, package assembly, device qualification, and product reliability testing, tape and reel services. Gain Blocks, GaN Power Amplifiers, MCMs And Hybrids.


 , JP
One stop R&D for device construction proposal, design, process proposal, prototype building, reliability testing, and volume production

Ningbo ChipEx Semiconductor Co., Ltd

 , CN Manufacturer
OSAT. Wafer Level CSP、FC-Bumping and other related business, also provide wafer testing, packaging design, packaging and testing

Shanghai Simat Microelectronics Technology Co., Ltd

 , CN Manufacturer
OSAT (outsourced semiconductor assembly and test) company.

Shanghai Genpek Semiconductor Technology Co., Ltd

 , CN Manufacturer
OSAT (outsourced semiconductor assembly and test) company.

Shanghai Beixin Semiconductor Technology Co., Ltd

 , CN Manufacturer
advanced packaging substrate design, simulation, processing, MEMS sensor/optical device packaging design and processing, professional Wafer/MPW thinning, dicing, automatic chip sorting, rapid packaging (ceramic & plastic packaging production lines)

National Center for Advanced Packaging, NCAP China

 , CN Manufacturer
Packaging Design & Simulation, Mid-End Wafer Level Packaging Technology, Microsystem Integration Technology, Test & Analysis, Optoelectronic Devices Packaging Technology

HENGHUI Technology Corporation

 , CN Manufacturer
Integrated circuit enterprise, which sets lead frame, module packaging, wafer thinning, dicing and testing as one

The MiQro Innovation Collaborative Center, C2MI

 , CA Service Company
International reference in the fields of advanced packaging and microsystems. The C2MI is a centre of excellence for commercialization and research (CECR)

Sahasra Semiconductors Pvt Ltd, SSPL

 , IN Manufacturer
NAND FLASH IC packaging and testing

China Resources Microelectronics Limited, CR Micro

 , CN Manufacturer
Wafer Foundry, Assembly, Wafer Tes,t Product Test, Mask Manufacturing