Packaging Services, OSAT

RF series products, power series products, and high-end heat dissipation materials, and provides high-power packaging and testing services.

Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications

OSAT. Semiconductor packaging and testing service.

IC Packaging Service, Open Cavity Packages, Test Socket, Polyimide(PI)

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

OSAT. Semiconductor packaging and testing service.

OSAT, semiconductor packaging and testing. Test : Memory, SoC, CIS, RF, PMIC (Wafer and Package Test)

PACKAGE ASSEMBLY, BALL- WEDGE- RIBBON BONDING FLIP CHIP BONDING, TEST AND DESIGN SERVICES

MEMS foundry

Production of memory and sensors based on magnetic tunnel structures with 90/65 nanometers nodes on 300mm wafers.

RF High Reliability Space Products, Test Engineering Development services, Test, package assembly, device qualification, and product reliability testing, tape and reel services. Gain Blocks, GaN Power Amplifiers, MCMs And Hybrids.

One stop R&D for device construction proposal, design, process proposal, prototype building, reliability testing, and volume production

OSAT. Wafer Level CSP、FC-Bumping and other related business, also provide wafer testing, packaging design, packaging and testing

OSAT (outsourced semiconductor assembly and test) company.

OSAT (outsourced semiconductor assembly and test) company.

advanced packaging substrate design, simulation, processing, MEMS sensor/optical device packaging design and processing, professional Wafer/MPW thinning, dicing, automatic chip sorting, rapid packaging (ceramic & plastic packaging production lines)

Packaging Design & Simulation, Mid-End Wafer Level Packaging Technology, Microsystem Integration Technology, Test & Analysis, Optoelectronic Devices Packaging Technology

Integrated circuit enterprise, which sets lead frame, module packaging, wafer thinning, dicing and testing as one

International reference in the fields of advanced packaging and microsystems. The C2MI is a centre of excellence for commercialization and research (CECR)

NAND FLASH IC packaging and testing