AmTECH Microelectronics
Morgan Hill, US Manufacturer, Service Company 55-60
AmTECH Microelectronics is a custom microelectronics assembly and advanced packaging services company located in Silicon Valley, CA. The company specializes in prototype to low-medium volume production on-shore manufacturing.
SUZHOU HUATAI ELECTRONICS CO., LTD
, CN Manufacturer
RF series products, power series products, and high-end heat dissipation materials, and provides high-power packaging and testing services.
Silitronics Inc
, US Manufacturer, Service Company
Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications
GEM Electronics (Shanghai) Co., Ltd.
, CN Manufacturer, Service Company
OSAT. Semiconductor packaging and testing service.
Standard Systems Inc
, KR Distributor, Manufacturers' Rep
IC Packaging Service, Open Cavity Packages, Test Socket, Polyimide(PI)
Hyrel Incorporated
, US Manufacturer, Service Company
Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.
DOOSAN TESNA INC.
, KR Manufacturer
OSAT. Semiconductor packaging and testing service.
AT Semicon Co., Ltd.
, KR Service Company
OSAT, semiconductor packaging and testing. Test : Memory, SoC, CIS, RF, PMIC (Wafer and Package Test)
Miretech Co., Ltd
, KR Manufacturer, Service Company
PACKAGE ASSEMBLY, BALL- WEDGE- RIBBON BONDING FLIP CHIP BONDING, TEST AND DESIGN SERVICES
Atomica Corp
, US Manufacturer
MEMS foundry
Crocus Nano Electronics Ltd
, RU Manufacturer
Production of memory and sensors based on magnetic tunnel structures with 90/65 nanometers nodes on 300mm wafers.
Criteria Labs Inc
, US Manufacturer, Custom Manufacturer
RF High Reliability Space Products, Test Engineering Development services, Test, package assembly, device qualification, and product reliability testing, tape and reel services. Gain Blocks, GaN Power Amplifiers, MCMs And Hybrids.
CONNECTEC JAPAN Corporation
, JP
One stop R&D for device construction proposal, design, process proposal, prototype building, reliability testing, and volume production
Ningbo ChipEx Semiconductor Co., Ltd
, CN Manufacturer
OSAT. Wafer Level CSP、FC-Bumping and other related business, also provide wafer testing, packaging design, packaging and testing
Shanghai Simat Microelectronics Technology Co., Ltd
, CN Manufacturer
OSAT (outsourced semiconductor assembly and test) company.
Shanghai Genpek Semiconductor Technology Co., Ltd
, CN Manufacturer
OSAT (outsourced semiconductor assembly and test) company.
Shanghai Beixin Semiconductor Technology Co., Ltd
, CN Manufacturer
advanced packaging substrate design, simulation, processing, MEMS sensor/optical device packaging design and processing, professional Wafer/MPW thinning, dicing, automatic chip sorting, rapid packaging (ceramic & plastic packaging production lines)
National Center for Advanced Packaging, NCAP China
, CN Manufacturer
Packaging Design & Simulation, Mid-End Wafer Level Packaging Technology, Microsystem Integration Technology, Test & Analysis, Optoelectronic Devices Packaging Technology
HENGHUI Technology Corporation
, CN Manufacturer
Integrated circuit enterprise, which sets lead frame, module packaging, wafer thinning, dicing and testing as one
The MiQro Innovation Collaborative Center, C2MI
, CA Service Company
International reference in the fields of advanced packaging and microsystems. The C2MI is a centre of excellence for commercialization and research (CECR)