Standard Systems is the service provider of turnkey based semiconductor assembly providing following services.
1) Consult IC Packaging
2) Find cost effective IC Packaging
3) Locate sub-contractors for actual IC Packaging.
4) Involve Engineering & production related follow-up.
5) Communicate very closely between customers and sub-contractors.
6) Supply finished packages to customers directly or by drop shipment.
Standard Systems has connections with qualified sub-contractors which are located in Korea and other Asian area. Standard Systems provides services with solution that meet our customer's budget and size objectives.
Laminate Substrate BGA
PBGA
FBGA
Quad Flat No-Lead packages
QFN/DFN/MLF
Quad Flat Packages
MQFP/ w Drop-In Heat Spreader
LQFP/ExposedPad LQFP
TQFP/ExposedPad TQFP
PLCC
Dual-In-Line Packages
TSOP(I)/ TSOP(II)/ TSSOP/ExposedPad TSSOP
SOIC/ExposedPad SOIC/ Power SOP
SSOP/ExposedPad SSOP/Power SSOP
SOJ/ PDIP/SDIP
Discrete Packages
DPAK/ D2PAK/SOT
Others
Dummy BGA molded Substrates
Dummy QFN molded lead frame
Note : Dummy IC(Dummy Components, Mechanical IC) are not electrical functional parts, and used for machine set-up, acceptance and demonstration of pick and place equipment, educational training, evaluation of solder pastes, SMT processes and printed circuit board rework. Daisy Chain and standard dummy components are available.
