Electronic Products (EPI)
Newburyport, US Manufacturer $1.0-30.0 Mil 1-70
Electronic Products (EPI) manufactures high-quality hermetic electronic packaging using advanced glass-to-metal and ceramic-to-metal sealing technologies, tailored for harsh environments and critical applications.
RJR Technologies
, US Manufacturer
Air Cavity Near Hermetic Semiconductor Packaging. Air Cavity Plastic Packages, B-Stage Components, Sealing Equipment
OPTOSEM TECHNOLOGIES SDN. BHD.
, MY Manufacturer
Pre-molded Lead Frame Package (Air Cavity Package) and Lid Cover
Botou Hi-Tech Electronic Accessories Co., Ltd
, CN Manufacturer
Hermetic packages, glass-to-metal seals
Yixing City Jitai Electronics Co.,Ltd
, CN Manufacturer
Hermetic packages: Opto-Electronic Packages, Power Packages, Microwave Packages, HIC Packages, TO Headers, Circular Packages, Sensor Packages, High Purity Graphite Molds, Kovar Lids
Hebei Sinopack Electronic Technology Co., Ltd.
, CN Manufacturer
Multilayer co-fired ceramic packages (HTCC, LTCC), ceramic substrates
Mirror Semiconductor, Inc.
, US Manufacturer, Distributor
Open Cavity QFN package and lids, test sockets, bonding wire
Suzhou Bopai Semiconductor Technology Co., Ltd
, CN Manufacturer
AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems
Meizhou Exhibition Electronic Technology Co.,Ltd
, CN Manufacturer
Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC
SDI Corporation
, TW Manufacturer
LED Lead Frames, Discrete, Transistor, IC Lead Frames, VFD Frame, BGA Heatsink, FPC
Standard Systems Inc
, KR Distributor, Manufacturers' Rep
IC Packaging Service, Open Cavity Packages, Test Socket, Polyimide(PI)
Zhen Ding Tech. Group Technology Holding Limited, ZDT
, CN Manufacturer
IC substrates and HDI PCB. Printed circuit boards, including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), rigid-flex PCBs, chip-on-film (COF), and modules
TTM Technologies, Inc
, US Manufacturer
IC substrates, quick-turn and volume production of technologically advanced PCBs and backplane assemblies as well as a global designer and manufacturer of high-frequency radio frequency (RF) and microwave components and assemblies.
Shennan Circuits Co., Ltd, SCC
, CN Manufacturer
IC substrates and HDI PCB.
SAMSUNG ELECTRO-MECHANICS
, KR Manufacturer
IC package substrates.
Nan Ya PCB Co., Ltd
, TW Manufacturer
IC substrates and HDI PCB
Kyocera Global Ltd
, JP Manufacturer
Ceramic packages, organic packages and module substrates, HDI PCB, PWB, single crystal sapphire products, semiconductor/LCD processing equipment
Korea Circuit Co Ltd, KCC
, AF Manufacturer
IC packages substrate and HDI PCB, rigid-flex PCB.
Kinsus Interconnect Technology Corp.
, TW
IC substrates and HDI PCB.
IBIDEN CO LTD
, JP Manufacturer
IC Package, HDI Printed Wiring Board, SiC-DPF, Substrate Holding Mat, Graphite Specialty