Packages

Air Cavity Near Hermetic Semiconductor Packaging. Air Cavity Plastic Packages, B-Stage Components, Sealing Equipment ​

Pre-molded Lead Frame Package (Air Cavity Package) and Lid Cover

Hermetic packages, glass-to-metal seals

Hermetic packages: Opto-Electronic Packages, Power Packages, Microwave Packages, HIC Packages, TO Headers, Circular Packages, Sensor Packages, High Purity Graphite Molds, Kovar Lids

Multilayer co-fired ceramic packages (HTCC, LTCC), ceramic substrates

Open Cavity QFN package and lids, test sockets, bonding wire

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

LED Lead Frames, Discrete, Transistor, IC Lead Frames, VFD Frame, BGA Heatsink, FPC

IC Packaging Service, Open Cavity Packages, Test Socket, Polyimide(PI)

IC substrates and HDI PCB. Printed circuit boards, including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), rigid-flex PCBs, chip-on-film (COF), and modules

IC substrates, quick-turn and volume production of technologically advanced PCBs and backplane assemblies as well as a global designer and manufacturer of high-frequency radio frequency (RF) and microwave components and assemblies.

IC substrates and HDI PCB.

IC package substrates.

IC substrates and HDI PCB

Ceramic packages, organic packages and module substrates, HDI PCB, PWB, single crystal sapphire products, semiconductor/LCD processing equipment

IC packages substrate and HDI PCB, rigid-flex PCB.

IC substrates and HDI PCB.

IC Package, HDI Printed Wiring Board, SiC-DPF, Substrate Holding Mat, Graphite Specialty

IC substrates and HDI PCB.