Flip Chip Substrate Introduction & Application
Product Outlines
The die is directly attached to the substrate which plays as the connection between the chip and PCB by using solder bumps rather than gold wires. By taking the advantage of substrates, the ability of logic gate could fan out the most inputs to the other logic gate efficiently. Meanwhile, the different ways of packaging improve I/O ports on flip chip substrates, which would be the developing trend in the future.
Types of Package
Pin Grid Array (PGA)
Land Grid Array (LGA)
Ball Grid Array (BGA)
Product Applications
Pin / Land Grid Array
： Microprocessor
Ball Grid Array
： Graphic Microprocessor, Northbridge Chipset, High-end ASIC Chipset, Set-top Box Chipset
Wire Bond Substrate Introduction & Application
Product Outlines
By using gold wires to connect the chip and electrical pads from the substrate, the substrate is known as "Wire Bond Substrate". It plays the function as the buffer between the chip and PCB. By taking the advantage of substrates, the ability of logic gate could fan out the most inputs to the other logic gate efficiently.
Types of Package
Ball Grid Array (BGA)
Plastic BGA (PBGA)
Chip Scale Package (CSP)
Wire Bonding CSP
Flip Chip CSP (FC-CSP)
Window BGA
Product Applications
BGA： MCP, Southbridge Chipset,Communication, Networking
CSP： Memory (DRAM, Flash), Portable Device, Handset, Consumer Electronics, PC Peripheral Device
