Substrates

Copper clad laminates

IMS and HTC materials, IC Substrate Materials, Flexible Materials, HSD Materials

Multilayer Ceramics Equipment: Roller Benches, Tape Casters, Sheet Blankers, Punching Machine, Screen Printers/Tunnel Dryers, Print AOI, Stacking Machines, Screen Printer- Stacker Laminators, Green Cutters, Metallization, SMD Component Inspection.

SSD Module, PCB Memory Module, PCB Multi-layer Module. Semiconductor Package Substrate

Multilayer wiring board (MWB)

Semiconductor Targets, Powdered Metals, Chemical Precursors, Flat Panel Display and Solar Targets, Organic Light Emitting Diode Materials

Special polymer materials for electronics

motors, solenoids, micro-switches, flexible printed circuits and micro electronics.

Grinding and polishing tools, coolants, electronic pastes for thick film technology, thick film substrates.

IC substrates and HDI PCB. Printed circuit boards, including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), rigid-flex PCBs, chip-on-film (COF), and modules

IC substrates, quick-turn and volume production of technologically advanced PCBs and backplane assemblies as well as a global designer and manufacturer of high-frequency radio frequency (RF) and microwave components and assemblies.

IC package substrates, lead frames, display films, masks for OLEDs, glass substrates for FPD

IC substrates and HDI PCB.

IC package substrates.

IC substrates and HDI PCB

Ceramic packages, organic packages and module substrates, HDI PCB, PWB, single crystal sapphire products, semiconductor/LCD processing equipment

IC packages substrate and HDI PCB, rigid-flex PCB.

IC substrates and HDI PCB.

IC Package, HDI Printed Wiring Board, SiC-DPF, Substrate Holding Mat, Graphite Specialty

IC substrates and HDI PCB. Large semiconductor packaging substrates, Multilayer PCBs for ICT infrastructure devices such as supercomputers and high density HDI PCBs for edge devices such as in-vehicle equipment.