PCB Printed Circuit Board and PWB Printed Wiring Board

Tiger Electric specializes in manufacturing ultra high-layer count PCBs for advanced semiconductor and testing applications. We deliver high-performance, reliable solutions tailored to meet the demands of next-generation electronics.

We offer specialized PCB layout solutions for the semiconductor test industry, focusing on high-density and high-speed RF complex PCBs like Load boards, Probe cards, MLO, MLC and Burn-in boards.

Engineering Services, Cost effective Solution

SSD Module, PCB Memory Module, PCB Multi-layer Module. Semiconductor Package Substrate

Multilayer wiring board (MWB)

motors, solenoids, micro-switches, flexible printed circuits and micro electronics.

IC substrates and HDI PCB. Printed circuit boards, including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), rigid-flex PCBs, chip-on-film (COF), and modules

IC substrates, quick-turn and volume production of technologically advanced PCBs and backplane assemblies as well as a global designer and manufacturer of high-frequency radio frequency (RF) and microwave components and assemblies.

IC package substrates, lead frames, display films, masks for OLEDs, glass substrates for FPD

IC substrates and HDI PCB.

IC substrates and HDI PCB

IC packages substrate and HDI PCB, rigid-flex PCB.

IC substrates and HDI PCB.

IC Package, HDI Printed Wiring Board, SiC-DPF, Substrate Holding Mat, Graphite Specialty

IC substrates and HDI PCB. Large semiconductor packaging substrates, Multilayer PCBs for ICT infrastructure devices such as supercomputers and high density HDI PCBs for edge devices such as in-vehicle equipment.

IC substrates and HDI PCB.

Leadframe, IC substrate, precision metal parts in PCBA

Inkjet Coating Systems, Polishing Machinery

IC substrates. High-layer PCBs for semiconductors: SSD Module, PCB Memory Module, PCB Multi-layer Module, PCB Automotive Board, SPS MCP/UTCSP, FC-CSP, SiP (System in Package), PBGA/CSP, BOC, FMC, Automotive Substrate

PROBE CARD, INTERFACE BOARD, TEST SOCKET, TEST SYSTEM, HSIO LOOPBACK COMPONENT