The semiconductor industry has been well developed in Taiwan based on a couple of strengths, including strong engineering environment, significant capital investment, and more importantly, building up of complete supply chain and infrastructure. Semiconductor IC packaging technology migrates from lead-frame into BGA, CSP, and Flip-Chip driving the packaging industry with new product and technology. Kinsus invested and developed key technologies like finer feature pitch, thinner thickness, and sophisticated structure created technology strength. Along with sensitivity on market development and migration, Kinsus builds its leading edge in this industry.