Materials

Multilayer co-fired ceramic packages (HTCC, LTCC), ceramic substrates

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

LED Lead Frames, Discrete, Transistor, IC Lead Frames, VFD Frame, BGA Heatsink, FPC

Materials for semiconductor manufacturing process: polymer (Resin), photoresist (PAG), and additives, and materials such as Resin for SOC, Resin for BARC, and Acid Generators. Coating materials

Epi structures grown on GaAs and InP.

Thin-Film Substrates, Ceramics Products, Precision Products, Diamond Products, Contract Manufacturing Services

Small quantity epi-service on various substrates including Si, SiC and Sapphire but not limiting by them.

Microelectronics and optoelectronics epi-technology of III-V compounds with research and development and large-scale production by molecular beam epitaxy (MBE) technology.

photoresist resin for IC, SQ board,

Special polymer materials for electronics

Ceramic packages, organic packages and module substrates, HDI PCB, PWB, single crystal sapphire products, semiconductor/LCD processing equipment

IC packages substrate and HDI PCB, rigid-flex PCB.

IC substrates and HDI PCB.

Semiconductor chemicals, customizable chemistry platforms and low volatility silicones.

AlN ceramics, Al2O3 ceramics, BeO ceramics and BN ceramics (BN, PBN, HBN)

High-end printed circuit boards and IC substrates.

Gotoh manufacturing supplies leadframe products that meet the diverse needs of domestic and overseas semiconductor manufacturers by using the technologies of designing, manufacturing, stamping, and plating of moldings.

Lead frames

direct copper ceramic (DPC) circuit board such as LEDs Al2O3/AlN fine ceramic substrates , Flesh light module DPC , IR/UV , lighting ,Laser and Automotive used DPC substrate and sub-mount.

Transistor and power transistor lead frames. SOT/ SOD Lead Frame, IC, LED L/F.