LED

Production of LED lighting

SiC/SiC Epitaxy Wafer Service on 6”, as well GaN/Si on 6" and 8"

Multilayer co-fired ceramic packages (HTCC, LTCC), ceramic substrates

Ceramic metallized substrates (DBC, AMB), ceramic packages for LED, IC

LED Lead Frames, Discrete, Transistor, IC Lead Frames, VFD Frame, BGA Heatsink, FPC

ICP ETCHER, DRIE ETCHER, CCP ETCHER, LED ETCHER, NANO-IMPRINTER

Materials for semiconductor manufacturing process: polymer (Resin), photoresist (PAG), and additives, and materials such as Resin for SOC, Resin for BARC, and Acid Generators. Coating materials

Epi structures grown on GaAs and InP.

Thin-Film Substrates, Ceramics Products, Precision Products, Diamond Products, Contract Manufacturing Services

Small quantity epi-service on various substrates including Si, SiC and Sapphire but not limiting by them.

LED Automated Testing System, Optoelectronic Testing Instrument, Automated Equipment Development

MicroLED display solutions

Microelectronics and optoelectronics epi-technology of III-V compounds with research and development and large-scale production by molecular beam epitaxy (MBE) technology.

photoresist resin for IC, SQ board,

Wafer manufacturing equipment. LCD mnfr equipment, Wafer mounter and BG tape removal machines, dry lift-off machines, wafer and pkg substrate tape lamination and removal machines, UV irradiation equipment, film resist lamination machines.

Special polymer materials for electronics

Manual Prober, Semi-Auto Prober, Fully-Auto Prober for LED, diode, VCSEL. Wafer Thickness Metrology

Laboratory grade thin film measurement systems, spectroradiometers, integrating spheres and calibration light sources. NVLAP accredited calibration and testing laboratory

Ceramic packages, organic packages and module substrates, HDI PCB, PWB, single crystal sapphire products, semiconductor/LCD processing equipment