LED Assembly and Test Equipment

LED Automated Testing System, Optoelectronic Testing Instrument, Automated Equipment Development

Manual Prober, Semi-Auto Prober, Fully-Auto Prober for LED, diode, VCSEL. Wafer Thickness Metrology

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Trim/Form/Singulation Machine. Taping and tray packing machine. Connector assembly machine. Pin insert machine.

Auto Trim System Auto Form/ Singulation System Side View LED Trim / Form / Singulation System. LCD Glass Inspection System. Vision cropping. Ceramic reflector Sculpture system LED Trim / Form / Singulation System. LED Strip Cutting System. Connector asse

Semiconductor Assembly equipment, Sapphire Wafer Process Equipment, Precision mold & die parts manufacturing

trim/form equipment, semiconductor package inspection equipment, laser deflash equipment, and laser marking equipment among semiconductor post-processing equipment.

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

Probe cards, wafer prober and test sockets for semicoductor test, and providing equipment (testers, probe unit and prober) for array inspection, TEG test, Open/Short test, cell panel inspection and repair equipment for FPD.

Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

Automatic 8-12-inch wafer probing system, full automatic LED probing system, double sided probe station, manual analytical probe station as well as all-in-one test station (LIV, FFT and NF) for VCSEL.

Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

Pick and Place, Die attach equipment.

Crystal oscillator manufacturing equipment, Camera module equipment, Pick Up assembly equipment, Flat Panel equipment, Other conveying and automatic assembly systems

LED equipment: LED Prober, Sorter, Die Transfer, Taping Machine, Phosphor Coater, CSP Blade Cutter, Dispenser. FPD Equipment: Laser Lift-Off, Laser Cutting System, Prober. Laser scribing and marking. Die (chip) transfer systems.

Reflow Checkers, Viscometers, Specific gravity meter, Spectrophotometer, Solder Paste print inspection system, vacuum mixing system

Precision dispensing systems

Front end and packaging equipment for IC, FPD, MEMS and LED.