LED Wafer Process Equipment/Machine
◆Sapphire Thickness Measuring Machine
›› None-touched laser detector, Z axis auto adjust the distence of laser detector
›› Measurement for 4 process (Wax, Grinding, 1st step polishing, 2nd step polishing).
›› PC may link with CIM and up-load the measuring data to particular file folder in WEB harddisk.
›› Allow to proceed offline measurement.
◆Sapphire Wafer Laser Marking machine
›› 4 Axial (X,Y,Z,θ) control.
›› CCD detect and auto adjust the shift of X,Y,θ
›› Top or bottom side marking.
›› The marking data can be summarize and filing.
◆Sapphire Thickness Sorting Machine
›› Server moter control the location of cassette
›› 3 Axial (X,Y,Z) control
›› Used Laser detector, precision ±2um (untouched measurment).
›› The cassette numbering can be set up by reading bar code label of work sheet and summary the measuring data in file.
IC Trim/Form System
◆High-Speed Trim Machine
›› PRESS CAPACITY:29/3 KN/Ton
›› SPEED:100 SPM
›› AIR RPESSURE:< 80 DB
›› CONVERSION TIME:15 min (Varies by product)
◆High-Speed T/F/S Machine
›› PRESS CAPACITY:29/3 KN/Ton
›› SPEED:90 SPM
›› AIR RPESSURE:< 80 DB
›› CONVERSION TIME:5 min (Varies by product)
Injection Molding Machine
◆Hybrid Injection Molding Machine
›› Hybrid System
›› Low Cost，High productivity
›› Eco-friendly，Low power consumption，Low noise emission
›› Total Solution
