Inspection and Metrology Equipment

Semiconductor and FPD Equip: Non-Pattern Surface Inspection System (WM series), Pattern Inspection System (Vi series), Bump Height Inspection System, TSV / Trench Depth Measurement System, Proximity Exposure System (TME series), Visual Inspection System.

AI Vision Solution, AOI Solution(DISPLAY/ Secondary Battery/ Semiconductor/ Automobile, etc.), LASER Solution

LED/OLED Equipment: Wireless logistics, Micro LED Chip AOI Inspector, Dispenser, PAD Cleaner, COG FOG AOI. Semiconductor: Mount Inspector, Wire Bonding, Die Attach, Wafer Warpage, WRS Inspector, STOCKER system, Wafer Edge, Macro Tower Lifter, STB, Rail.

Inspection Optic System, Inspection Review Optic system, Laser Repair Optic System, Wafer nano scratch inspection optic system

FPD equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder. OLED Inspection, Edge Inspection, Various AOI Inspection Equipment. Laser processing equipment. Semiconductor: Loader＆Unloader, FOUP Packing Machine.

SIMPL- SEM Image Metrology PLatform, Process control monitoring : Image Quality (IQ), Process control monitoring : IC-Metric, Mask Data Preparation

Hermes CO2 Bubbler, AOI, Metis Magic Water, ESD Nozzle, AGV

Laser marking, dicing and scribing equipment for wafers, wafer thickness measurement equipment, substrate defect detection machine

Fast, nondestructive, electrical characterization tools under production conditions, measuring parameters like minority carrier lifetime, photoconductivity and resistivity.

PillarHall test chips, Measurement Software

Maskless photo lithography equipment, Laser de-bonding equipment, inspection and sorting equipment

Semiconductor inspection equipment, Various lamps, Light source equipment

Semiconductor front end metrology equipment: optical metrology series for film thickness & properties, and optical critical dimensions; plus X-ray metrology series for film thicknesses, material properties and compositions, surface contamination.

Manual Prober, Semi-Auto Prober, Fully-Auto Prober for LED, diode, VCSEL. Wafer Thickness Metrology

micro- and nanomechanical property measurement instruments that can be applied in a wide variety of testing environments.

Automatic Wafer Loader, Automatic, Semiauto and Manual Wafer Mounter, Automatic and Manual Wafer ID and Frame ID Reader and Automatic Wafer Packer / Unpacker / Sorter

Semiconductor temperature control device series (Chiller), robot series (Wafer Sorter / AMR), local scrubber (Local Scrubber) and other special equipment, is now widely used in semiconductors, LED, LCD and other fields

BEOL semiconductor equipment: laser marking, wafer inspection, wafer jet deflashing systems, tape and reel machines. Test handlers, pick and place inspection, trim/sort machines,

Wafer edge profile measurement machine,

AOI glue inspection machine: semiconductor packaging process FLUX and Underfill glue optical inspection equipment, which can measure glue width, glue overflow, glue shortage, glue creep and other related conditions