In-process measuring Equipment

Laser marking, dicing and scribing equipment for wafers, wafer thickness measurement equipment, substrate defect detection machine

micro- and nanomechanical property measurement instruments that can be applied in a wide variety of testing environments.

AOI glue inspection machine: semiconductor packaging process FLUX and Underfill glue optical inspection equipment, which can measure glue width, glue overflow, glue shortage, glue creep and other related conditions

Mueller matrix measurement systems for determining the polarization properties of materials and optical components, applications ranging from birefringence mapping and polarizer testing to LCD cell gap testing and thin-film measurements.

NEMS develops plasma technologies and provides plasma surface treatment solutions, including vacuum and atmospheric plasma machines. NEMS plasma machines can be used for surface cleaning surface etching and surface modification

Measuring Systems & Measuring Tasks, Measuring Systems, Wafer Inspection, MEMS Inspection, WAFERinspect AOI, Confocal Microscopy

Wafer optical metrology tools for the semiconductor industry.

3D Interferometry Microscope for sub-nanometer to millimeter surface profiling. Precision measurement for Semiconductor, MEMS, PV cell, Surface Engineering, OLED, etc.

Wafer inspection system and in-situ process monitoring equipment.

Process monitoring and control systems for the semiconductor, solar PV, LED and FPD markets.

Manufacturer of in situ, in-line, and ex situ thin film metrology tools designed to improve processe. Our thin film metrology tools are used to monitor nearly all thin-film deposition processes, including MBE, MOCVD, PLD, PVD, sputtering, and evaporation