Molding Equipment

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Press welding heads (titanium, molybdenum, copper, ceramics, etc.), semi-automatic hot press, fully automatic hot press, pulse system modules, platform fixtures, semiconductor equipment and other related products.

Molding equipment, Trim & foam equipment, Automatic tape sticking, Peeling device, Composite mold equipment, Insert molding equipment, Automatic assembly machine

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

Semiconductor Assembly equipment, Sapphire Wafer Process Equipment, Precision mold & die parts manufacturing

Lead frames, TO- headers, ceramic packages, stamping and molding dies, press mold equipment.

Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

TFT LCD and OLED equipment, FPD AOI Equipment. MEMS packaging equipment

Molding Systems, Handlers, trim and Form Systems, Stamping and T/F die set.

Auto Guided Vehicles (AGV), L/F inspection machine, laser marking system, dispence system, post mold cure system, rotary test handler, tube to tray handler, tube-to-tube test handler.

Semiconductor molding machine

Post-bond inspection system, die coater, molding adhesion promoter station, cleaning station, vessel tanks

Molding equipment for semiconductor packaging

Equipment for leadframe, substrate and wafer level packaging applications.

Development and supply of advanced transfer molding and sintering systems.

Molding and singulation equipment for semiconductor packaging.

Manufacturer of auto molding system, trim & form system, servo hydraulic machine,semiconductor post-process auxiliary devices and precision moulds (such as auto-molding chase, trim & form die, MGP mould, etc. )

Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.