At TOWA, we market molding equipment (resin sealing equipment) that utilizes the transfer method. With this method, a flowable resin for protecting the semiconductor chips is applied to the area around the semiconductor chip via a gate (supply port) before it is cured. In addition, we have also developed and market molding equipment that utilizes the compression method, whereby semiconductor chips are immersed in a flowable resin in advance and then the flowable resin is cured. Semiconductor manufacturers use larger lead frames and substrates in an attempt to improve productivity and reduce the production cost. In addition, semiconductor molding technologies are required to be compatible with the slimmer dimensions and higher integration of semiconductor devices and with increased thickness for compatibility with power devices and modularization. Our molding equipment caters to these various needs.
Together with molding equipment, singulation system is one of the core equipments for the post process of semiconductor manufacturing. We develop dicers as a main function of singulation systems, thereby providing the optimal method of singulation for each type of manufactured product. In addition, our singulated product handlers contribute to improving customers' productivity with high throughput.
Ever since our establishment in 1979, we have been manufacturing ultra-precision molds by utilizing the module system, in which one ultra-precision mold is produced by combining divided parts. We have opened up a new era with this system.
The transfer mold in the multi-plunger design was born during this system evolution.
We have also developed the compression mold as a new molding process. We thus continue to provide leading-edge ultra-precision molds.
Transfer Molds
Transfer Molds
Transfer molds in the multi-plunger design
Transfer molds in the multi-plunger design feature multiple resin-feeding pots, which significantly increases the effective utilization ratio of resin, reduces the molding cycle, and dramatically improves the molding quality.
We meet the customers' demands for complicated, high-precision packages with our proprietary ultra-precision processing technologies.
We also boast highly reliable quality evaluations of molds and products, which are enabled by the latest measuring devices.
Compression Molds
Compression Molds
Compression Molds
We have dramatically improved our resin sealing technologies by developing compression molds following transfer molds in the multi-plunger design.
Compression molds manufactured with our ultra-precision processing technologies provide high-precision, high-quality products by minimizing damage in the molding of low-k materials, thinning wires, and even large substrates and wafers.
Manufacturing Technologies
Our manufacturing plant has a large number of unique CNC machines for realizing ultra-precision processing.
We have built the world's most advanced production line that manufactures high-precision molds with stable quality by introducing an automated production system, a continuous unmanned operation system compatible with high-mix low-volume production, and our proprietary manufacturing system with artificial intelligence system (AIS), which are linked with CAD/CAM.
These ultra-precision processing technologies have begun to be applied in a wide variety of fields as listed below, rather than being used solely for semiconductors.
Fine plastics
Ultra-precision/microfabrication technology
EF (ultra-precision electroforming) process technology
Coating technology
production line with ultra-precision processing
World's most advanced production line with ultra-precision processing
micron-level processing and palette changer
Electric discharge machine that is capable of micron-level processing (left) and palette changer (right)
