Other Equipment

AMB ceramic substrates. Research, design and prototype advanced packaging concepts. Low to medium package assembly and transfer to volume OSATs. Advanced transfer molding and sintering systems

Semiconductor: FOUP Cleaner, POD Cleaner, Wet Station, Chemical Delivery Supply System, Metal Lift Off, Cassette & Magazine Cleaner. Display: OLED Mask Cleaner, Glass Cleaner, Etcher & Stripper, Auto Macro Inspection, Stream-Jet Printing, Lamination M/C,

Multilayer Ceramics Equipment: Roller Benches, Tape Casters, Sheet Blankers, Punching Machine, Screen Printers/Tunnel Dryers, Print AOI, Stacking Machines, Screen Printer- Stacker Laminators, Green Cutters, Metallization, SMD Component Inspection.

Quick turn semiconductor modification solutions. Robotic Hot Solder Component Tinning, Component Solder Ball Removal and Replacement, Component Tape and Reel Packaging Services, Component Bake and Dry Pack Services.

LCD/OLED In-line Production System. Process equipment: 3D Lamination, Dispenser, Grinder, Bake Oven, Furnace Oven, Micro LED Dispenser.

Wet Station, Ultrasonic Cleaner, Tube Cleaner and Parts Cleaner for semiconductor and FPD production parts cleaning equipment. Chemical Supply System

THC (Temperature & Humidity Controller), Dehumidifier, CHR (Chiller)

AI Vision Solution, AOI Solution(DISPLAY/ Secondary Battery/ Semiconductor/ Automobile, etc.), LASER Solution

CMP (Chemical Mechanical Polishing), Wet Cleaning Systems. Display Equipment: Wet Station, APP (Atmospheric Pressure Plasma Cleaner), CO₂Cleaner, Coater & Track System. CMP Slurry and nano dispersion solution

Laser processing equipment for semiconductor, display, PCB

Thermal LPCVD, Plasma Treatment System, Thermal ALD System, Dry Cleaning System

LED/OLED Equipment: Wireless logistics, Micro LED Chip AOI Inspector, Dispenser, PAD Cleaner, COG FOG AOI. Semiconductor: Mount Inspector, Wire Bonding, Die Attach, Wafer Warpage, WRS Inspector, STOCKER system, Wafer Edge, Macro Tower Lifter, STB, Rail.

Central Chemical Supply System / Wet System / Inkjet Printing System for semiconductor and display

Sputtering System, OLED System, Solar Module System, AMHS, AS/RS, 3D Printer, Converting Machine

Wafer Transfer Robots, FOUP Handling Robot, Reticle / Mask Handling Robot, Load Port / Loader, Aligners, EFEM (Equipment Front End Module)

Automated storage and retrieval system (AS/RS) Shuttle system Uni-SHUTTLE HP 3D robot warehousing system ALPHABOT Smart AGV Premex XIO Automated forklift Premex SLX Self-driving carriage-mounted Automated forklift Premex SLX with SVS AGV (automated guided

FPD equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder. OLED Inspection, Edge Inspection, Various AOI Inspection Equipment. Laser processing equipment. Semiconductor: Loader＆Unloader, FOUP Packing Machine.

Silicon Test Wafer, Dummy/Mechanical Wafer, Silicon Spacer wafer, Epitaxial wafer, photomask,

Wafer box, wafer carrier, wafer cassette, wafer carrier handle, RSP (reticle SMIF pod), RSP opener, mask case, chip tray, fluoro valves, cleanroom supplies, wafer and cassette cleaning systems