Enpasulation and Decapsulation Equipment

Molding equipment, Trim & foam equipment, Automatic tape sticking, Peeling device, Composite mold equipment, Insert molding equipment, Automatic assembly machine

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

Automation equipment for semiconductor, passive components and LED manufacturing process. Dispensers, Die and Wire Bonders, AOI and Measurement, Testers and Sorters.

Manufacture laser decapsulation system. Failure analysis equipment distributor

Laser marking, cutting and decapsulation machines.

TFT LCD and OLED equipment, FPD AOI Equipment. MEMS packaging equipment

IC decapsulation systems. Dry Etching Systems. Failure Analysis Testing System.

Products for Semiconductor Failure Analysis, sample preparation and counterfeit IC detection.

Semiconductor package decapsulation equipment.

Flip chip bonder, manual probers and accesoires. Laser decapsulation systems.

Microwave and plasma technology. Microwave generators, plasma systems and components, magnetrons, waveguide components.

Equipment for leadframe, substrate and wafer level packaging applications.

Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation

Development and supply of advanced transfer molding and sintering systems.

Molding and singulation equipment for semiconductor packaging.

Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.