Welcome to Nisene Technology Group, Inc., the innovators of advanced integrated circuit decapsulation systems used in the failure analysis of encapsulated integrated circuits. Our market-leading automated wet chemistry JetEtch systems are now complemented by our new PlasmaEtch microwave-induced plasma systems that address today’s leading-edge packaging and materials.
Our proprietary PlasmaEtch MIP system delivers a safe and reliable etch for all material types with no need for ultrasonic cleaning, which can damage bond structures. See slider below and under our “PlasmaEtch” product link.
