JIACO Instruments MIP decapsulation system is a breakthrough innovation:
Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilizing only Oxygen and patent-pending Hydrogen-based recipes.
Application Range:
I. Wire Bond:
Ag Wire (patent-pending)
Cu, PCC, Au, Al Wire
Fresh & Thermally Stressed
II. Flipchip:
RDL
Cu Pillar, Solder Bump
Fan-in and Fan-out WLP
III. Chip:
BOAC
GaAs, GaN
SAW, BAW
IV. Package:
2.5/3D
PCB
SiP, CoWoS
V. Failure Type:
EOS
Migration
Corrosion
Contamination
VI. Encapsulant:
High Tg
Glob Top
Underfill, DAF, FOW
Clear Mold, Die Coat
