Besi is engaged in one line of business: the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries.
Besi develops and supplies leading edge systems offering high levels of accuracy, reliability and productivity at a low cost of ownership. Besi offers customers a broad portfolio of systems which address substantially all the assembly process steps involved in leadframe, substrate and wafer level packaging. Besi's principal product and service offerings include:
Die Attach Equipment
Besi produces single chip, multi chip, multi module and flip chip, TCB and eWLB die bonding systems and die sorting systems.
Packaging Equipment
Besi produces conventional, ultra thin and wafer level molding, trim & form and singulation systems.
Plating Equipment
Besi produces tin, copper and precious metal plating systems and related process chemicals.
Service
Besi provides tooling, conversion kits and spare parts and other services for its installed base of customers worldwide.
