Capcon Limited Co., Ltd

 , HK Manufacturer
Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder

Palomar Technologies, Inc

 , US Manufacturer
automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

ficonTEC Service GmbH

 , DE Manufacturer,  Custom Manufacturer
automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).

Shibaura Mechatronics Corp.

 , JP Manufacturer
Equipment for flat-panel displays, semiconductors and optical film sputtering equipment, and of vacuum equipment and laser equipment.

Finetech GmbH & Co. KG

 , DE Manufacturer
Sub-micron and advanced die bonders.

idonus sàrl

 , CH Manufacturer
MEMS equipment and components

Guangzhou Minder-Hightech Co.,ltd

 , CN Manufacturer
Wire bonders, soldering and dispencing robots, welding machines. LCD repair equipment. Environment testing equipment.

BE Semiconductor Industries N.V., Besi

 , NL Manufacturer
Equipment for leadframe, substrate and wafer level packaging applications.


 , SG Manufacturer
Bonders, WLP packaging solutions

Pac Tech – Packaging Technologies GmbH

 , DE Manufacturer
State-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries.

Infotech AG

 , CH Manufacturer,  Custom Manufacturer
Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.