, HK Manufacturer
Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder
, US Manufacturer
automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.
, DE Manufacturer, Custom Manufacturer
automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).
, JP Manufacturer
Equipment for flat-panel displays, semiconductors and optical film sputtering equipment, and of vacuum equipment and laser equipment.
, CN Manufacturer
Wire bonders, soldering and dispencing robots, welding machines. LCD repair equipment. Environment testing equipment.
, NL Manufacturer
Equipment for leadframe, substrate and wafer level packaging applications.
, SG Manufacturer
Bonders, WLP packaging solutions
, DE Manufacturer
State-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries.