adwelds corporation
, JP Manufacturer
Manufacturing machines for: Power device, Semiconductor, Electronic Components, Flat Panel Display, Plastics, Automotive, Medical appliance and other peripheral equipment, devices, and machines. Design, Maintenance, Instalment, and Sales
Capcon Limited Co., Ltd
, HK Manufacturer
Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder
Palomar Technologies, Inc
, US Manufacturer
automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.
ficonTEC Service GmbH
, DE Manufacturer, Custom Manufacturer
automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).
Shibaura Mechatronics Corp.
, JP Manufacturer
Equipment for flat-panel displays, semiconductors and optical film sputtering equipment, and of vacuum equipment and laser equipment.
Finetech GmbH & Co. KG
, DE Manufacturer
Sub-micron and advanced die bonders.
ORION SYSTEMS INTEGRATION PTE LTD
, SG Manufacturer
TCB Bonders
idonus sàrl
, CH Manufacturer
MEMS equipment and components
Guangzhou Minder-Hightech Co.,ltd
, CN Manufacturer
Wire bonders, soldering and dispencing robots, welding machines. LCD repair equipment. Environment testing equipment.
BE Semiconductor Industries N.V., Besi
, NL Manufacturer
Equipment for leadframe, substrate and wafer level packaging applications.
KULICKE AND SOFFA INDUSTRIES, INC
, SG Manufacturer
Bonders, WLP packaging solutions
Pac Tech – Packaging Technologies GmbH
, DE Manufacturer
State-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries.
Infotech AG
, CH Manufacturer, Custom Manufacturer
Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.