Hybrid Bonder

Capcon provides innovative solutions like Flip-Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder, Stack Die Bonder, Pannel-Level Die Bonder, Multi-Chip Die Bonder

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).

Equipment for flat-panel displays, semiconductors and optical film sputtering equipment, and of vacuum equipment and laser equipment.

Sub-micron and advanced die bonders.

TCB Bonders

MEMS equipment and components

Wire bonders, soldering and dispencing robots, welding machines. LCD repair equipment. Environment testing equipment.

Equipment for leadframe, substrate and wafer level packaging applications.

Bonders, WLP packaging solutions

State-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries.

Solutions for power module production, die bonding and fluid dispensing. Semiconductor and optoelectronic packaging platforms and cell.