This experience helps us to develop equipment and processes for specific requirements.
FINEPLACER® lambda 2
Sub-Micron Bonder
Semi-automated Sub-Micron Die Bonder
FINEPLACER® sigma
Advanced Sub-Micron Bonder
FINEPLACER<sup>®</sup> femto2 - Automated Prototype2Production Bonder
FINEPLACER® femto 2
Advanced Sub-Micron Bonder
Silitronics uses a Finetech die bonder for extremely complex flip chip, sensor and opto-electronics applications, along with co-development of new assembly processes for leading semiconductor customers. The bonder has allowed us to help customers develop, optimize, verify and enhance many state-of- the art technologies. Our partnership with Finetech has been very rewarding and their willingness to provide constructive application support in a timely manner, along with their design and manufacture of quality custom tooling, are second to none.
FINEPLACER® femtoblu
High Accuracy Bonder
FineXT 6003
Large-Area Multi-Chip Bonder
Flip Chip Bonder for R&D labs
FINEPLACER® pico ma
Multi-Purpose Bonder
FineXT 5205
Multi-Purpose Bonder
Hot air BGA rework station
FINEPLACER® pico rs
Hot Air SMD Rework Station
Hot air SMD rework station
FINEPLACER® coreplus
Hot Air SMD Rework Station
