Soldering, Desoldering, Rework Products

Tools for semiconductor assembly: DIE BONDING TOOL, WIRE BONDING, DISPENSING, BACK END, PRECISION TOOL, ACCESSORY, FLIP CHIP, TAPE & REEL

Solder Ball, Solder Powder, Solder Paste, Conductive Particle Cored Solder Ball, Low Alpha Tin, Silver nanowire, Thermally Conductive Paste, EMI Shielding Paste

Wet process stations, Resist processing equipment, Dicing equipment, PCB processing equipment

Semiconductor Equipment, OVEN, CHAMBER, LED Equipment, LCD Equipment, Connector Tool, Insert Machine, Automobile Part Test Equipment.

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

Daisy Chain test components, zero ohm PCB jumpers and engineering evaluation kits for experimentation. We make vibration dampers to extend the life of PCB assemblies and CCGA Column Grid Array to reduce stress caused by extreme thermal CTE mismatch.

Conductive Die Attach, Non Conductive Polymer, Flux, Solder Balls

Turbo Molecular Pumps, Dry Vacuum Pumps, Roots Vacuum Pumps, Oil-sealed Rotary Vacuum Pumps, Liquid-ring Vacuum Pumps, Ejectors, Vacuum Systems, Vacuum Pumping Systems.

Solder Materials Manufacturer

Flux, solder and solder balls, factory automation equipment. Bearings and plating anode

Innovative soldering products. Wafer Bumping Flux, Wafer Bumping Paste Flux, Flip Chip Flux, Ball Attached Paste Flux. Solder Analysis Program using a state-of-the-art Arc/Spark Analyzer.

Dispensing Tools, Stamping Pin, Pick Up Tool, Die Collet, Jet Nozzle, Die Bonding Tools, Epoxy Stamping Tools, Ejection Needle, Micro Tube, Module Ferrule and Metal Tube

IC assembly tools. Wafer handling, die bonding, wire bonding tools. Lead frame and PCB magazines.

Sub-micron and advanced die bonders.

Die and wire bonding tools, fluid and solder dispencing tools, manual die bonders, 4-point probes.

Tacky flux for ball mounting, solder flux and pastes for bumping and coating semiconductor package, OSP, Ga2O3 substrates.