Semiconductor Materials
Qualitek offers a range of technologically advanced materials engineered to fulfill the demanding applications for the semiconductor industry. Qualitek’s offerings include Wafer Bumping Fluxes, Wafer Bumping Paste Fluxes, Flip Chip Fluxes and Ball Attached Paste Fluxes.
Semiconductor Materials
Type Features Flux Type Application Method Flux Classification Halogen Content
WF-710 Wafer Bumping Flux: Uniform bump shape, non-corrosive to underbump metallization. Contact Sales For SDS | WF-710 TDS | Flyer | Water-Soluble Spin Coating ORL0 Halogen-Free
WF-711 Wafer Bumping Flux: Avoids wetting on copper pillar. Contact Sales For SDS | WF-711 TDS | Flyer | Water-Soluble Spin Coating ORH0 Halogen-Free
PF-709WB Wafer Bumping Paste Flux: consisten printability, excellent attachment of solder spheres onto wafer. Contact Sales For SDS | PF-709WB TDS | Flyer |
Water-
Soluble
Printing ROL0 Halogen-Free
Delta X1 Flip Chip Flux: Extremely low residue, compatible with underfills. Contact Sales For SDS | Delta X1 TDS | Flyer | No-Clean Dipping ROL0 Zero-Halogen
PF-709AD Ball Attached Paste Flux: Stable transfer volume, excellent attachment of solder spheres onto BGA/CSP. Contact Sales For SDS | PF-709AD TDS | Flyer | Water-Soluble Pin Transfer /Dipping ORH0 Halogen-Free
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