Plating Materials

Multilayer Ceramics Equipment: Roller Benches, Tape Casters, Sheet Blankers, Punching Machine, Screen Printers/Tunnel Dryers, Print AOI, Stacking Machines, Screen Printer- Stacker Laminators, Green Cutters, Metallization, SMD Component Inspection.

Sputtering Targets, Gilding Materials, Conductive Pastes.

Equipment for wet surface treatment (Capacity: 100L or below), testing and analyzing equipment for wet surface treatment, surface treatment related products (equipment, materials and chemicals).

Solder Ball, Solder Powder, Solder Paste, Conductive Particle Cored Solder Ball, Low Alpha Tin, Silver nanowire, Thermally Conductive Paste, EMI Shielding Paste

Grinding and polishing tools, coolants, electronic pastes for thick film technology, thick film substrates.

a distributor for specialist materials, chemistries and processes for Semiconductor, PCB, EIF and APT. With a wide portfolio from several specialist manufacturers.

Ohmega Technologies produce OhmegaPly® resistors, that are used for electronics (smart phone MEMS microphones) to aerospace and defense electronics (satellites, space probes, missiles and fighter aircraft).

High-purity electronic process chemicals, chemical distribution systems and total chemical management services.

Solder Materials Manufacturer

High Purity Etching Gases, ALD/CVD Precursors, Copper Plating Materials

Flux, solder and solder balls, factory automation equipment. Bearings and plating anode

Innovative soldering products. Wafer Bumping Flux, Wafer Bumping Paste Flux, Flip Chip Flux, Ball Attached Paste Flux. Solder Analysis Program using a state-of-the-art Arc/Spark Analyzer.

specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor.

Lactic acid and alanine for electroless plating, cleaning agents and solvents.

Plating chemicals and surface finishing systems.

Plating chemicals and equipment for manufacturing printed circuit boards, package substrates, semiconductors, leadframes and connectors

Production and sales of chemicals, machines, and auxiliary equipment for surface treatment

Plating chemicals for Cu wafer plating, wafer bump plating, electroless COF plating. Wet process control equipment. Ceramic materials and components.

Electroplating, fluxes, inorganic compounds, high purity metals, sintering pastes, solders, TIM, thin film materials.

Photoresists and ancillaries production. Functional printed electronics materials.