Semiconductor Materials
High Purity Etching Gases
PRODUCT NAME USE FORMULA PURITY（％） BOILING POINT（℃）
ADEKA HIGH-PURITY CHLORINE Etching Gas Cl2 ≧99.999 -34.1
ADEKA HIGH-PURITY HYDROGEN BROMIDE Etching Gas HBr ≧99.999 -66.7
ADEKA HIGH-PURITY BORON TRICHLORIDE Etching Gas BCl3 ≧99.9999 12.5
ALD/CVD Precursors
Product property list
PRODUCT NAME USE FORMULA PURITY（％） BOILING POINT（℃）
ADEKA SUPER TEOS Dielectric Film Si(OC2H5)4 ≧99.999995 166
ADEKA HIGH-PURITY TMOP Dopant PO(OCH3)3 ≧99.999995 197
ADEKA HIGH-PURITY TEOP Dopant PO(OC2H5)3 ≧99.999995 215
ADEKA HIGH-PURITY TMB Dopant B(OCH3)3 ≧99.999995 69
ADEKA HIGH-PURITY TEB Dopant B(OC2H5)3 ≧99.999995 118
PRODUCT NAME USE FORMULA Vapor pressure
TEMAZ High-k Zr[N(C2H5)(CH3)]4 1Torr / 90℃
Copper Plating Materials
CLASSIFICATION CHARACTERISTICS
Base Solution (VMS) High Purity Copper Sulfate Solution
Additives Accelerator Application of high current density is possible by original composition.
Additives Suppressor The various surfactants of ADEKA possession are used.
Additives Leveler It can efficiently plate TSV of a high aspect.
Quality Control System
"In order to improve quality assurance function of high-purity semiconductor products, in 2003 we constructed equipment dedicated for analysis and quality control in our Kashima Plant. We control high accuracy analysis to be required for the next generation semiconductor in combination with manufacturing, thereby seeking to speed up responses to customers.
We have acquired the international quality management standards ISO9001 and the international environmental management system standards ISO14001 at an earlier stage."
