ISHIHARA CHEMICAL Co.,Ltd

Lead-free Plating
Sn-Bi alloy plating
Sn plating*
Sn-Ag alloy plating
Sn-Cu plating process
Neutral Sn plating
Wafer Bump Plating
Sn-Ag alloy plating
Sn-Pb alloy plating
Electroless Plating
Electroless Sn plating for COFs
Electroless Sn plating for thick applications
Electroless Pd plating for printed circuit boards
Wafer Copper Plating
W-10 process

Ceramics Materials
MACOR^®
MACOR®
MACOR® provides high performance in vacuum chamber because of zero porosity, no outgassing and it is machinable with metal working tools.

SHAPAL^®Hi Msoft
SHAPAL®Hi Msoft
material which provides flexural strength similar to Alumina and high thermal conductivity.

Boron-nitride
Boron-nitride
Boron-nitride withstands high thermal shock resistance because of low thermal expansion and high thermal conductivity.

Aluminum-nitride
Aluminum-nitride
Aluminum-nitride provides high thermal conductivity, low thermal expansion, excellent electrical insulation and high rigidity.

Alumina
Alumina
Alumina provides versatile applications because of heat resisting and electrical insulation properties.

Zirconia
Zirconia
Zirconia provides the highest strength and toughness at RT.

Silicon-carbide
Silicon-carbide
Silicon-carbide provides an excellent rigidity and corrosion resistance.

Printed Wiring Boards (TAB/COF)
Analytical equipment for use with wet processes in printed wiring board and TAB/COF manufacturing
Process    Model    Managed components    Catalog no.
Development    Na2CO3    pH, sodium carbonate, resist    M-01
K2CO3    pH, potassium carbonate    M-02
Soft etching    Na2S2O8 , H2SO4 , Cu    Sodium persulfate, sulfuric acid, copper    M-08
H2O2 , H2SO4 , Cu    Hydrogen peroxide, sulfuric acid, copper    M-07
Etching    CuCl2    Hydrochloric acid, cupric chloride    M-16
Stripping    NaOH    Sodium hydroxide    M-05
Desmear    NaMnO4 , NaOH    Sodium permanganate, sodium hydroxide    M-19
Catalyst    Pd    Palladium    M-26
DMAB    Dimethylamine-borane    M-15
Electroless copper plating    NaOH , HCHO , Cu    Sodium hydroxide, formalin, copper    M-21
Electrolytic copper plating (copper sulfate bath)    H2SO4 , Cu , Cl    Sulfuric acid, copper , Chlorine    M-29
Fe3+    Trivalent iron    M-17
Black oxide    NaClO2 , NaOH    Sodium chlorite, sodium hydroxide    M-12
K2S2O8 , NaOH    Potassium persulfate, sodium hydroxide    M-20
Electroless nickel plating    Ni , NaH2PO2    pH, nickel , NaH2PO2    M-13
Ni    pH, nickel    M-22
DMAB    Dimethylamine-borane    M-15
Plastic Plating Market
Analytical equipment for use with a variety of plastic plating wet processes
Process    Model    Managed components    Catalog no.
Degreasing    NaOH    Sodium hydroxide    M-30
Catalyst    Pd    Palladium, chromium    M-25
Electroless nickel plating    Ni , NaH2PO2    pH, nickel , NaH2PO2    M-13
Electrolytic copper plating (copper sulfate bath)    H2SO4 , Cu , Cl    Sulfuric acid, copper , Chlorine    M-29
Electro-nickel plating (Watts bath)    Ni , Cl , H3BO3    Nickel sulfate, nickel chloride    M-23
Conductive processing    Cu    Copper    M-28
Flat-panel Display Market
Analytical equipment for use with wet processes in printed wiring board and TAB/COF manufacturing
Process    Model    Managed components    Catalog no.
Cleaning    TMAH    Tetramethylammonium hydroxide    M-03
NaOH    Sodium hydroxide    M-30
KOH    Potassium hydroxide    M-06
Development    Na2CO3    pH, sodium carbonate    M-01
TMAH    Tetramethylammonium hydroxide    M-03
NaOH    Sodium hydroxide    M-30
KOH    Potassium hydroxide    M-06
MEA    Monoethanolamine    M-04
TEA    Triethanolamine    M-18
Etching    Ce , HNO3    Ceric nitrate, nitric acid    M-11
C2H2O4    Oxalic acid    M-09
H3PO4 , HNO3 , C2H4O2    Phosphoric acid, nitric acid, acetic acid    M-10
Stripping    Na2CO3    pH, sodium carbonate    M-01
NaOH    Sodium hydroxide    M-30
KOH    Potassium hydroxide    M-06
MEA    Monoethanolamine    M-04
Plating Processing Market
Analytical equipment for use with electroless, electroplating wet processes
Process    Model    Managed components    Catalog no.
Electrolytic degreasing    NaOH    Sodium hydroxide    M-05
Electroless copper plating    NaOH , HCHO , Cu    Sodium hydroxide, formalin, copper    M-21
Electroless nickel plating    Ni , NaH2PO2    pH, nickel , NaH2PO2    M-13
Electro-nickel plating (sulfamic acid bath)    Ni , Cl , H3BO3    Nickel sulfamate, nickel chloride, pH, Boric acid    M-24
Electro-nickel plating (Watts bath)    Ni , Cl , H3BO3    Nickel sulfate, nickel chloride , pH, boric acid    M-23
Electro-copper plating (copper sulfate bath)    H2SO4 , Cu , Cl    Sulfuric acid, copper , Chlorine    M-29
Fe3+    Trivalent iron    M-17
Zinc plating (zincate bath)    Zn, NaOH    Zinc, sodium hydroxide    M-14
Electro-alloy plating (black Ni-Zn)    Zn    Zinc    M-14
Ni    pH, nickel    M-22
Electroless-palladium plating    Pd    Palladium    M-31
Electroless-gold plating    Au    pH, gold    M-27
Electro-gold plating    Au    pH, gold