Idonus was founded in 2004 as a start-up company from the Institute of Microengineering - Neuchâtel (IMT), in Neuchatel, Switzerland.
We are specialized in the development and fabrication of equipment for the MEMS industry.
Our strength lies in the customization of our products for every customer. The vertical integration of the company enables a fast prototyping, which results in short lead times for the customer.
The company is based in the heart of the Swiss Watch Valley, where precision micromachining meets a growing cluster of companies working micro- and nanotechnology.
MEMS Manufacturing Equipment
HF Vapor Phase Etcher
Infrared Microscope
Wet Process Wafer Chucks
Electrostatic Chucks
Shadow Mask Aligner
Multiple Chip Vacuum Chuck
Wafer Bonding Inspection Device
Chip to Chip Bonder
UV LED Exposure System
UV-EXP
UV-LED photolithography exposure
MAS + DIM
Modular alignment systems
IR-M
Infrared (IR) microscope
HF VPE
HF Vapor Phase Etchers
E-chuck
Electrostatic chucks
WPWC and WEDC
Wafer chucks for wet processes
WBI
Wafer bonding inspection
CCB
Chip-to-chip anodic bonder
Other products
Products
The idonus core products are cleanroom equipment for MEMS microfabrication.
On this page, we have classified these products in two categories of equipment:
Mask alignment (MAS, DIM ) and photolithography exposure (UV-EXP ), and the combination of both (PLX )
Systems for MEMS microfabrication (VPE, E-chuck, WPWC, CCB ) and inspection (IR-M, WBI )
Mask aligner and photolithography
Mask Alignment solutions (MAS )
Shadow Mask Aligner
Double Image Microscope (DIM )
Mask Aligner with DIM (MAS + DIM )
UV-LED Exposure Systems
(UV-EXP series)
A wide range of exposure systems with the UV-EXP series:
UV-EXP150R: Ø150 mm exposure area
UV-EXP150S: 150 × 150 mm² exposure area
UV-EXP200R
UV-EXP200S
UV-EXP300S
Entry-level product: UV-LAB100R
Hg-vapor lamp retrofitting and customized designs:
UV-EXP600S: Very large exposure area 600 × 600 mm² (implies customized design for systemintegration)
Retrofitting of Hg-based mask aligners
Customized mounting base using standard UV-EXP products
Customized design of UV-EXP for other dimensions (e.g., size < 150R)
Photolithography Exposure
(PLX series)
PLX are complete systems combining alignment and UV exposure. The PLX series combines the MAS + DIM with the UV-EXP equipment.
PLX150: with a UV-EXP150R or UV-EXP150S
PLX200: with a UV-EXP200R or UV-EXP200S
MEMS microfabrication
HF Vapor Phase Etcher (VPE series)
VPE series:
VPE100: up to Ø100 mm wafers
VPE150
VPE200
Other variants and a wide range of accessories
Electrostatic chuck (E-chuck)
Electrostatic clamping of multiple chips or parts of wafers
Wet Process Wafer Chucks (WPWC ) +
Wafer Chuck for Uniform Electrodeposition (WEDC )
Mechanical chucks for wafers chemical etching or for uniform electrodeposition
Chip to chip bonder (CCB )
System for the anodic bonding of dies
MEMS inspection
Infrared Microscope (IR-M )
Microscope with IR sensitive camera
Wafer bonding inspection (WBI )
Inspection of full wafers (e.g., after fusion bonding) by means of Infrared (IR) imaging
Other products
Multiple chip vacuum chuck
End-of-life (EOF) products are availabe only for clients that had previously purchased these products
