Optical Inspection Equipment

Semiconductor and FPD Equip: Non-Pattern Surface Inspection System (WM series), Pattern Inspection System (Vi series), Bump Height Inspection System, TSV / Trench Depth Measurement System, Proximity Exposure System (TME series), Visual Inspection System.

Mask/LED/LCD/OLED Laser Repair. Atmospheric SEM, AVI (Auto Visual Inspection) for OLED, TFT AOI

Wet Station, Ultrasonic Cleaner, Tube Cleaner and Parts Cleaner for semiconductor and FPD production parts cleaning equipment. Chemical Supply System

LED/OLED Equipment: Wireless logistics, Micro LED Chip AOI Inspector, Dispenser, PAD Cleaner, COG FOG AOI. Semiconductor: Mount Inspector, Wire Bonding, Die Attach, Wafer Warpage, WRS Inspector, STOCKER system, Wafer Edge, Macro Tower Lifter, STB, Rail.

Inspection Optic System, Inspection Review Optic system, Laser Repair Optic System, Wafer nano scratch inspection optic system

FPD equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, Mother Glass Grinder. OLED Inspection, Edge Inspection, Various AOI Inspection Equipment. Laser processing equipment. Semiconductor: Loader＆Unloader, FOUP Packing Machine.

Measuring Microscopes and Objectives, Mask Aligner

Tabletop Scanning Electron Microscope (SEM), Sample Preparation- Cross Section Polisher

Raman microscopes

3D Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), Conformal Coating Inspection (CI AOI), Automated X-ray Inspection (AXI), Manufacturing Defects Analyzer (MDA), In-Circuit Tester (ICT)

X-ray and CT Systems, Laser Radar Measuring Systems, 3D Laser Scanners, CNC Video Measuring Systems, Optical Manual Measuring, Industrial Microscopy

advanced optical metrology systems and ultra-precise optical components and assemblies. 3D Optical Profiler Systems, Laser Interferometer Systems, Absolute Position Sensors, Displacement Position Sensors, Optical Components, Optical Assemblies

AI Vision Inspection, Ultrasonic ACF Bonding

Display equipment: Edge Grinder, Edge Profiler, Drilling Machine, Cover Glass Grinder, OLED and FPD AOI Inspection and laser process equipment. Semiconductor equipment:FOUP Packing Machine, Wafer Grinder, Laser process equipment.

Products used for dispensing adhesives, coatings, sealants, biomaterials and other materials; for fluid management; for test and inspection; and for UV curing and plasma surface treatment.

3D AOI machines for packaging, wire bonding and wafer inspection.

automatic optical inspection equipment (AOI) for the flat panel display industry (FPD) , with integrated circuit (IC) industrial process inspection equipment as the forefront, and solar cell (PV) industrial inspection equipment as its expansion

Defect detection on wafers, crystal slip defect detection, wafer geometry inspection, UV curing system.

Our products and services include optical emission spectroscopy, end point detectors and plasma monitors, film thickness measurement tools and application S/W used for the process control in semiconductor manufacturing.

automated optical and X-ray inspection system for printed circuit board assemblies (PCBA), semiconductor package, or power module