Hologenix Inc.

The Magic Mirror Inspection Method

The Magic Mirror or Makyoh (meaning 'magic mirror' in Japanese) refers to a bronze mirror originating from ancient China that reflects an image to a distant wall when the Sun shines on the mirror. A relief pattern, resembling the projected image, is engraved on the back side of the mirror; no pattern can be seen on the front side by the naked eye.

The 'magic' of the mirror can be understood using simple geometrical principles: the local irregularities of the reflecting surface act as concave or convex mirrors therefore a collimated light beam impinging on the surface produces an image on a screen that, to a certain extent, reflects the mirror's morphology. The front-face microdeformations (invisible to the naked eye) are caused by the stresses due to the engraved back image.

The Makyoh concept is a powerful topographic tool for the characterization of the morphology of glass and mirror-like surfaces, such as semiconductor wafers. The sensitivity of the method is a 0.4 μm height difference over a 10 mm distance and 50 nm over a 0.5 mm distance. Makyoh topography has proven its power, for example in detecting flaws induced by wafer slicing, polishing, lapping, and defects in directly bonded Si wafers.

Automatic Defect Detection & Classification
Automated Die Inspection
Precision Dimensional Metrology
Critical Dimension (CD) and Overlay Metrology Automatic and Manual Operation

Surface & Edge Defect Detection
Texture Defect Detection (e.g. stains, etc.)
Missing or Deformed Object Detection
Extensive Defect Review Capability
Graphic Maps & Image Archival
CAD file import
The NGS Series defect detection and metrology systems are designed for applications where automated optical defect detection and precision dimensional measurements on wafers and other parts are required. They are well suited for dual use as production tools or as versatile process development systems. These systems offer a choice of high end microscope components (Olympus/Nikon/Leica), BF/ DF/ DIC illumination, and linear motor staging with 0.02 micron scales. There are several configurations available depending on your requirements. These include:a 200mm platform, a 300mm platform and a robotic platform for automated wafer and part handling.

Hologenix 200mm and 300mm Automated Edge Batch Defect Detection

Automatically detect mid & large sized defects (diameter larger than 100um) such as Cracks, Chips, Scratches and Particles at the wafer edge.

All wafers in the cassette are inspected simultaneously.

An entire cassette of wafers can be inspected in 60 seconds (200mm wafers).

Images of the defects are automatically stored on the PC.

The standard system provides for manual placement of the cassette(s) on the tool.

Various options include: Automatic Cassette Load and Unload, Bar Code Reader, Fan Filter Unit with HEPA-ULPA, and Host communication.

Additional configurations include: 150mm and 100mm sizes.





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