PV Equipment

LASER TECHNOLOGY IN THE PRODUCTION OF SOLAR CDTE, CIGS AND PEROVSKITE MODULES. Laser Edge Deletion, Laser Structuring & BIPV, CIGS Backend Processing

Wet Station, Ultrasonic Cleaner, Tube Cleaner and Parts Cleaner for semiconductor and FPD production parts cleaning equipment. Chemical Supply System

Sputtering System, OLED System, Solar Module System, AMHS, AS/RS, 3D Printer, Converting Machine

Inspection Optic System, Inspection Review Optic system, Laser Repair Optic System, Wafer nano scratch inspection optic system

OLED Display Manufacturing Equipment, Thin-Film Photovoltaic Cell Manufacturing Equipment, Vacuum Process Equipment

Deploying floating solar power plants.

Solar PV Projects integrator

Design and manufacture of automation equipment.

Semiconductor front end metrology equipment: optical metrology series for film thickness & properties, and optical critical dimensions; plus X-ray metrology series for film thicknesses, material properties and compositions, surface contamination.

Laboratory grade thin film measurement systems, spectroradiometers, integrating spheres and calibration light sources. NVLAP accredited calibration and testing laboratory

Solar energy manufacturing equipment, solar cells & modules, and solar power solutions,

Ion implanter family from medium current, high current and high energy implanters, to implanters for special applications and third-generation semiconductors for 28-nanometer manufacturing process. Solar manufacturing equipment.

Vacuum equipment for thin film coatings

Trim/Form/Singulation Machine. Taping and tray packing machine. Connector assembly machine. Pin insert machine.

advanced optical metrology systems and ultra-precise optical components and assemblies. 3D Optical Profiler Systems, Laser Interferometer Systems, Absolute Position Sensors, Displacement Position Sensors, Optical Components, Optical Assemblies

Evaporation, sputtering, PE-CVD, ion beam deposition and other equipment for the needs of the semiconductor, opto-electronics and display, microscopy and microanalysis markets.

20-nano-class semiconductor silicon wafer cleaning equipment.

AI Vision Inspection, Ultrasonic ACF Bonding

Automation solution for the application of industrial control, real-time data, warning system of earthquakes and hydrology, the power-monitoring.