Exposure & Direct Write Equipment

EUV HVM Reflectometer, EUV Accelerated Exposure Tool, Actinic Image Review System (AIRES®), EUV Pellicle Transmission Measurement System, EUV Pellicle High-Speed Mapping Tool, EUV N&K and Phase Measurement Tool, EUV Resist Outgassing Tool

Semiconductor and FPD Equip: Non-Pattern Surface Inspection System (WM series), Pattern Inspection System (Vi series), Bump Height Inspection System, TSV / Trench Depth Measurement System, Proximity Exposure System (TME series), Visual Inspection System.

EVAPORATION SOURCE (Point Source, Linear Source) and VACUUM SYSTEM (OLED System, Sputtering System)

Nanoimprint lithography (NIL) tools, resists, masks, and processes for a variety of NIL including thermal and photo-curable NIL, as well as direct imprinting of materials.

Semiconductor vacuum equipment and parts. Alignment, Bonding, Annealing, LC Filling, Vacuum Sealing Equipment. Glove box/ Gas purification equipment. Fluxless reflow equipment/ Reduction bonding equipment.

Mass production projection exposure system, CVS equipment QUALILAB ELITE, AXP2.0-DFP2, UV-LED optics for aligner/cure, UV exposure irradiation unit

Multi-Beam Mask Writer (MBMW) offers both precision and exceptionally-high productivity for mask technology nodes from 28 to 5 nanometers (nm).

Measuring Microscopes and Objectives, Mask Aligner

Semiconductor inspection equipment, Various lamps, Light source equipment

Mask Aligners, UV Exposure Systems, Solar & Photovoltaic, UV Meters, Resistivity Meters

mask aligner and photolithography specialists providing custom-engineered contact/proximity mask aligners.

Lithography equipment Process equipment, Testing Equipment, Photolithography Equipment, Sol wafer

Micro-nano direct writing, R&D and production of maskless direct imaging and lithography equipment.

Sputter, E-Beam, Thermal Evaporator, ALD, PEALD, RIE, PECVD, and LPCVD in manual, Semi-Automated or Fully Automated Solutions.

Mask Aligner, Total Lithography Solution, Spin Coater System, Mask Spin Cleaning System, Wet Station System, Exposure System, Glass Scribing Machine

Process cassettes. Automated and manufal wafer handling products. Bulk aligners. Mask picks, inspection stations, RSP openers.

Automation solution for semiconductor, FPD, LED, MEMS. Wafer handling and mask, reticle handling systems.

Digital-digital (Digital-Step-Scan, DiSS) devices and related components and devices.

Advanced Process Control and Yield Management Software. Defect Inspection and Metrology Systems. Epi Thickness & Composition. Lithography Systems.

Maskless Laser Direct Writing lithography machine.