Syskey Technology Co., Ltd. is a leading supplier in high quality thin film equipment for R&D and industrial production. Syskey product portfolio range from Sputter, E-Beam, Thermal Evaporator, ALD, PEALD, RIE, PECVD, and LPCVD in manual, Semi-Automated or Fully Automated Solutions. One of our strength is customizing and realizing thin film systems to our customers’ requirement. We believe in providing great quality product and honest service to our customers and have built enviable reputation and reliability with our worldwide customers. Following this success, Syskey continue to develop best equipment to meet our customers’ need for today and future.

Magnetron Sputter
Sputtering deposition is a PVD method in which a thin film is formed by sputtering a material from a target and then depositing it on a substrate.

Co-sputtering is simultaneous coating from two or multiple sputtering targets. It is used for compound - alloy or composite material.

UHV Sputter
For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process.

Multi-Layer Sputter
The high-quality multilayer films are becoming increasingly important in precision systems that single material thin film cannot practice the required specifications.

In-Line Sputter
In-Line Sputtering Deposition System is that substrates passed linearly beneath one or more sputter cathodes to acquire their thin film coating.

It has 4 independent sputtering chambers, allowing customers to arbitrarily match the deposited materials, while maintaining a quick and low-cost system.

Thermal Evaporation

The materials are placed in a resistive heat source in vacuum environment to evaporate directly to the substrate, where they condense back to a solid state form a thin film.

Metal Thermal

The evaporation source using electric heating can be used to deposit most organic and inorganic thin films, among which the resistance Joule method is the most common.

Organic Material

This process requires high precision and uniformity of thin films by accurately controlling temperature and deposition rate.

Electron Beam Evaporation

E-beam is generated from a tungsten filament and driven by electric and magnetic fields toward source material and transforms it into the gaseous phase to be deposited on the substrate surface.

E-Beam Evaporation System

E-beam deposition system is a method of using electron beam generated from an electron source in a vacuum to material, and heating and evaporating it so that the evaporated material forms a thin film on the substance.

UHV E-Beam

For UHV environment, it is very important to scientific research, because experiments often require surfaces to be maintained in a contamination-free state for the duration of the process.


Lift-Off is a process of creating pattern on the substrate surface and opposite to etching process.


Chemical Vapor Deposition is a chemical technology prepared from high-purity, high-performance solid materials.


PECVD alternate for depositing a variety of thin films at lower temperatures than conventional CVD methods without losing film quality.


It can provide some energy for the deposition reaction. Compared with the PECVD, ICP-CVD can deposit various films at a lower temperature without degrading the film quality.


This reaction at the surface is what forms the solid phase material. Low pressure is used to reduce of gas phase reactions, and also increases the uniformity across the substrate.


With the increase in size of LCD panels and glass need of manufacturing, manufacturing equipment has also become larger, requiring ever-larger equipment investments.


It can be considered as a special type of chemical vapor deposition. The majority of ALD reactions use two or more chemicals called precursors.

Thermal ALD

In most ALD reactions, two chemicals are used as precursors. These precursors react with the material surface in a continuous and self-limiting manner.

Plasma ALD

This process allows fabricating the conformal thin films of various materials with atomic-scale control without high temperature required to deliver the necessary activation energy.

Plasma Etching

Dry etching is known as plasma dry etching is the process of removing materials from the surface of another material.


The RIE process is a chemical physical etching process, and is the most important process for constructing various films in semiconductor manufacturing.


The high density plasma is created, surrounded by the coil, and act as the secondary coil in a transformer, accelerating the electrons and ions, and thus causing collisions that produce even more ions and electrons.

Cluster tool

The Multi-Chamber cluster coating system is a cluster of vacuum chamber systems interconnected through the transfer chamber which placed in center of cluster system.

Annealing Furnace

The annealing furnace is a process method used in the fabrication of semiconductors. This process includes heating a plurality of semiconductor wafers to affect their electrical properties.


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