Equipment

Poly Etcher System (Conductor Etcher System), Metal Etcher System, Oxide Etcher System (Dielectric Etcher System)

ICP ETCHER, DRIE ETCHER, CCP ETCHER, LED ETCHER, NANO-IMPRINTER

Mass production projection exposure system, CVS equipment QUALILAB ELITE, AXP2.0-DFP2, UV-LED optics for aligner/cure, UV exposure irradiation unit

Tabletop Scanning Electron Microscope (SEM), Sample Preparation- Cross Section Polisher

Provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.Probe Systems, Probes, Probe Cards, Metrology, Quantum Cryogenics.

automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow processes.

automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).

automated photonics assembly processes and machines for 3D nano-printing in the field of photonic multi-chip integration and packaging. Our solutions cover the entire range from small-scale prototyping to fully automated industrial production.

Ultrasonic coating solutions for MEMS/ Semiconductor, Protective Films for Dicing, Polyimide & Photoresist Coating, EMI Shielding Spray Coatings, Flip Chip Fluxing

LED/LED/OLED equipment. Secondary Battery Equipment. Camera Module Equipment. Test Equipment. Roll to Roll Equipment. Camera Module Smart Sensor

Sputter, E-Beam, Thermal Evaporator, ALD, PEALD, RIE, PECVD, and LPCVD in manual, Semi-Automated or Fully Automated Solutions.

Mask Aligner, Total Lithography Solution, Spin Coater System, Mask Spin Cleaning System, Wet Station System, Exposure System, Glass Scribing Machine