ficonTEC is a recognized market leader for automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits). Considerable process capability and dedicated assembly technologies have been accumulated in serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser assembly, sensing from bio-med to automotive, micro-optics, and more.
ficonTEC has consistently retained a unique modular approach to production equipment design. Today, with a globally installed base totaling over 700 machines, each one is the automated and optimized embodiment of a customer-defined process.
True to our ‘Photonics from Lab to Fab’ maxim, ficonTEC’s flexible and scalable automation options enable customized assembly and test solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – regardless of whether for contract manufacturing or for in-house corporate R&D and production.
A Modular Approach to Machines
Around 1000 machines delivered and installed globally, each being shaped by the needs of the customer and the application
Since starting in 2001, ficonTEC has become the market leader for individually customized solutions for semi or fully automated micro-assembly and testing of opto-electronic components, micro-optic assemblies and photonics-enabled devices.
Our machines employ industry-proven production technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and automated optical inspection. ficonTEC also provides a suite of test capabilities for individual components and hybrid opto-electronic devices, both on and off-wafer. Moreover, with everything being orchestrated by our flexible PROCESS CONTROL MASTER software, the machine platforms and product lines described below become so much more than just the sum of their parts.
The technologies and capabilities implemented in all machine platforms translate into a broad and established spectrum of production process expertise. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet and exceed efficiency and yield requirements even for cutting-edge production processes. For the team here at ficonTEC, we face your challenges every day.
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Product Platforms
Platforms that bridge the gap from R&D, process development, and through to complex, high-volume and even multi-line in-line production
Stand-alone machines
Traditionally our most popular and industry-proven machine format. With world-class performance, comprehensive customization options, and exceptional real-world reliability, these machines are best suited to complex production requirements requiring multi-functional, multi-step assembly, bonding or testing capability within a single, stand-alone machine system.
The stand-alone systems traditionally utilize machine housing formats of 300, 500/1000, 1500/2000 and up – the higher the number, the greater the available modular layout flexibility. 1000er systems and above are feed-system-capable, and different feed and cassette philosophies can be implemented to best suit the exact application.
Availability: Classified according to their primary function, machine type availability includes ASSEMBLYLINE, FIBERLINE, BONDLINE, CUSTOMLINE, TESTLINE, INSPECTIONLINE, STACKLINE and WELDLINE systems.
Suitable for: R&D development all the way through to high-volume manufacturing. Special purpose cells can be flexibly designed, and robotic systems incorporated to suit customer requirements. See individual product lines below for more feature details.
In-line machines
ficonTEC’s next-generation in-line machine systems feature improved modularity and flexible feed-in/out options in order to be in-line-capable from the ground up. Utilizing a more modern housing format this platform addresses increasing industry demand for greater versatility together with higher volume requirements production .
The new machine systems can be supplied individually as versatile stand-alone cells, or as task-optimized machine systems for production lines – singly or as segments comprising several different machine types. In principal, even entire production lines can be envisaged, encompassing the full suite of processes required for photonics assembly and test.
Utilizing newer machine housing formats of 800, 1200, 1600 and up – the higher the number, the greater the available modular layout flexibility. All in-line systems can be re-configured after product end-of-life, and thus be re-purposed for other (e.g. emerging) applications.
Availability: Classified according to their primary function, in-line machines are currently available as AssemblyLine, FiberLine, BondLine and TestLine – other functional types available on request.
Suitable for: R&D & NPI, cassette-to-cassette and in-line high-volume manufacturing, as well as for multiple production line set-ups operating in parallel and in sync. Special purpose cells can be flexibly designed, and robotic systems incorporated to suit customer requirements. See individual product lines below for more feature details.
Entry-level systems
Entry-level systems are designed to provide results representative of the more highly specified stand-alone machines. A small number of optional modules are available, and the cost-of-ownership is low. These units are primarily intended for laboratory use, R&D, low-volume proof-of-concept manufacturing and other low-complexity applications. Typical use includes align-&-attach of optical and opto-electronic components, fiber-optic and dies, respectively, for example as micro-optical packages or onto PICs or other chip substrates.
Availability: ASSEMBLYLINE A300, FIBERLINE F300 and BONDLINE B300.
In-line systems can also be stand-alone – which housing format best fits your needs?
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Product Lines
Functional machine types designed to accomplish class-leading flexibility, speed and results in photonic device production
Automated Photonic Assembly – ASSEMBLYLINE
High-precision, stand-alone and in-line assembly solutions designed for automated production (align-&-attach) of photonic devices. They uniquely combine fast-active alignment and flexible epoxy-based attachment configurations with a tried and tested software control interface, all in an industry-proven design. Optional modules provide additional functionality, including automatic tool changing, testing capability and wafer processing.
All ASSEMBLYLINE machines utilize our AUTOALIGN multi-axis motion systems (see below) – high-end stages with multiple degrees-of-freedom (from 3 up) combined with state-of-the-art real-time motion controllers, guaranteeing easy and accurate sub-µm pivot-point positioning.
Stand-alone machines: ficonTEC’s stand-alone AssemblyLine machines are designed to provide as much align-&-attach assembly capability as required in a single cell format. These machines are best suited to complex production requirements requiring multiple process steps within a single, stand-alone machine system.
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In-line machines: ficonTEC’s next-generation AssemblyLine machine systems utilize a modern housing format and flexible feed-in/out capabilities in order to be production-(in)-line-capable from the ground up. They can be supplied as a single and versatile production cell (analog to our stand-alone systems), or in combination with additional functional machine types as task-optimized production segments.
Availability: Stand-alone as AL300, AL500 / AL1000 and AL2000. In-line from A800 and up. An entry-level A300 system is also available.
AL300
AL500
ASSEMBLYLINE
Automated Fiber-Optic Assembly – FIBERLINE
FIBERLINE machines are high-precision, fast-active align-&-attach systems ideally suited for fiber-optic and waveguide-based components and devices, including fiber ribbon/arrays and silicon photonics. Various visible and NIR alignment lasers can be configured when attaching fibers to passive optical component such as photodiodes, PLCs, or AWGs. For fiber arrays multiple lasers can be controlled simultaneously. All common fiber connector types are catered for.
Like the ASSEMBLYLINE systems, FIBERLINE also utilizes our AUTOALIGN multi-axis motion systems (see below) – high-end translational and rotational stages with multiple degrees-of-freedom (from 3 up to 12 or more) combined with state-of-the-art real-time motion controllers, guaranteeing easy and accurate sub-µm pivot-point positioning and alignment.
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FIBERLINE‘s modular and expandable concept is customizable with a range of optional modules providing additional functionality, including testing or qualification. Automated fiber handling functionality is available in other product lines on request.
Availability: In-line as F1200. An entry-level F300 system is also available.
F300
FIBERLINE
Automated Precision Die Bonder – BONDLINE
Precision die bonder cells focused on passive high-resolution chip/die positioning coupled with thermal attachment (position-&-attach), with accuracies down to the micron and even sub-micron range. Feature-rich functional modules provide thermal management, multiple bond force modes and eutectic/epoxy/soldering attachment capability, thus catering to a wide range of individual bonding requirements.
BONDLINE is intended for chip-on-submount (CoS), MEMS/MOEMS and sensor assembly, as well as for other optical components, including laser diodes and hybrid assemblies on silicon photonics and other PIC devices. Optional modules provide additional functionality, including automatic tool changing, testing capability and wafer processing.
Stand-alone machines: ficonTEC’s stand-alone BondLine machines are designed to provide as much position-&-attach die bonder capability as required in a single cell format. These machines are best suited to complex production requirements requiring multiple process steps within a single, stand-alone machine system.
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In-line machines: ficonTEC’s next-generation BONDLINE machine systems utilize a modern housing format and flexible feed-in/out capabilities in order to be production-(in)-line-capable from the ground up. They can be supplied as a single and versatile production cell (analog to our stand-alone systems), or in combination with additional functional machine types as task-optimized production segments.
Availability: In-line from B800 and up. Stand-alone as BL300, BL500 / BL1000 and BL2000. An entry-level B300 system is also available.
BL300
BL500
BONDLINE
Adaptable Micro-assembly Platform – CUSTOMLINE
Sporting the largest range of optional modules available in any ficonTEC machine system, the CUSTOMLINE (previously COMPACTLINE) is our most adaptable and versatile multi-purpose micro-assembly platform. These systems are designed to provide highly flexible and individual solutions for a broad range of tasks in a wide range of industrial production environments, and especially suited to new product introduction (NPI).
Base systems include a pre-configured, high-precision motion system that carries the tools for assembly, die bonding, beam testing capability and/or wafer handling/processing. A variety of configurable functional modules together with clean-room compliance (ISO 6) makes the system an ideal, general-purpose and industry-capable photonic device production cell.
Availability: Stand-alone as CL1500 and CL2000. In-line formats form part of the product roadmap.
CL2000
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Electro-optical Device Tester – TESTLINE
Fully automated test-&-qualify systems for full LIV testing as well as spectral and near/far-field beam characterization of single laser chips, VCSELs, unmounted laser diode bars, and chip-on-submount (CoS) sources. Also available for a variety of other complex tasks, including singulated chip testing, automated optical inspection, and more. High-end models can be equipped with an optional wafer table for wafer-level testing of VCSELs and on-wafer devices.
A more recent addition to TESTLINE capability is compatibility with PXI-based optical instrumentation modules that leverage National InstrumentsTM LabVIEW graphical programming environment, making integration seamless and enabling the creation of sophisticated and fully automated, mixed-signal electro-optical test solutions to match individual requirements. A similar goal can also be achieved within non-LabVIEW and alternative instrumentation environments using modular benchtop and IOT-focused test equipment.
Stand-alone machines: ficonTEC’s stand-alone TESTLINE machines are designed to provide as much multi-functional test-&-qualify capability as possible in a single cell format. These machines are best suited to complex testing requirements requiring multiple steps within a single machine system.
In-line machines: ficonTEC’s next-generation TESTLINE machine systems utilize a modern housing format and flexible feed-in/out capabilities in order to be production-(in)-line-capable from the ground up. They can be supplied either as a single and versatile tester cell (analog to our stand-alone systems), or they can be supplied ‘in-line-capable’ together with additional functional type systems as task-optimized production segments.
Availability: In-line from T800 and up. Stand-alone TL500 / 1000 and TL2000.
TL2000
TESTLINE
WAFER TESTLINE
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Automated Optical Inspection – INSPECTIONLINE
Fully automated, multiple-camera-based systems available for a variety of complex and thorough inspection tasks. InspectionLine utilizes Deep Learning of typical facet images to achieve automated defect recognition. High-resolution pictures of all surfaces of interest and performing optical inspection based on the user’s criteria, and available with side, top and bottom wall camera-based inspection modules. Intended also for use with coated facets of semiconductor chips and PICs. Wafer table and other flexible feeding philosophies are optionally available.
Availability: Stand-alone as IL2000.
IL2000
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Laser Bar Stacking – STACKLINE
A unique machine providing fully automated stacking and/or unstacking of laser diode bars. It can handle any combination of laser bars and spacers (dummies), generating flush or staggered stacks. It can be optionally equipped with fully automated visual device inspection for sorting bars into the designated GelPaks or WafflePaks based on the inspection results.
Availability: Stand-alone as SL2000.
More info
Laser Welding – WELDLINE
A 2 or 3-beam vertical configuration, laser welding machine cell utilizing a fiber-coupled Nd:YAG laser and additionally featuring automatic alignment, device characterization, testing capabilities and sophisticated component tracking throughout the entire machine process.
Availability: Stand-alone as W300.
More info
Don’t see what you are looking for? Need product help?
Product designations are ‘moveable’, e.g. ASSEMBLYLINE can also possess ‘fiber’ and ‘test’ capabilities, CUSTOMLINE can feature ‘active assembly’, many systems are ‘wafer-capable’. There are certainly also some trending applications for which our systems are already capable or already in use, but that are not immediately findable here – LiDAR, co-packed optics, 5G infrastructure devices, through-silicon soldering are just a few. Speak to technical sales team to get the definitive answer!
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Sub-µm, Sub-arcsec, Multiple DOF, Pivot Point Positioning
High-end stages combined with state-of-the-art real-time motion controllers guarantee easy and accurate positioning
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AUTOALIGN
The AUTOALIGN series is ficonTEC’s range of multi-axis positioning modules, with varying degrees of translational and rotational freedom. These modules form the high-precision core of the all-important motion systems for our automated assembly machines, providing accurate and rapid positioning versatility, reliable and reproducible alignment as well as in-line process pick-&-place capability.
Starting with a 3-axis configuration, the AUTOALIGN systems can easily be scaled up to modules with 12 and more degrees of motion. Advanced interpolation firmware enables both fast-active alignment as well as the concept of a ‘pivot point’, the latter defining a specific reference point in space for a given component, rather than specifying single-axis coordinates. Nanometer resolution coupled with 50 nm and sub-arcsec repeatability.
Some tasks require an emphasis on translational positioning, others rotational, so in every case the appropriate choice can be made to best suit the application. Wherever an exceptional placement or movement precision is required, the AUTOALIGN systems are the motion systems of choice.
AUTOALIGN systems are supplied complete with motion controllers as well a computer installed with ficonTEC’s PROCESS CONTROL MASTER (PCM) user-friendly and process-oriented application software and control interface. They are shipped without a pre-installed process.
Photonic Device Assembly
Assembling the photonic devices that enable other industry sectors to move forward
Although the lion’s share of photonic device assembly is still for discrete components and devices, the recent developments in photonics integration illustrate well the ensuing dramatic evolution of the photonics market. In transitioning from the use of bulky macro-systems to micro-optical components to integrated optics, the photonics sector is experiencing what has become true for the electronics market since the 1970’s.
Irrespective of component size, the assembly of photonic devices still fundamentally depends upon precision positioning and alignment. Additionally, a high-precision and thermally capable bonding approach is key to the absolute performance and long-term reliability of the assembled component, as it directly affects lifetime (via heat dissipation) as well as operation and performance (via component temperature or residual stress). And by properly accounting for shrinkage during bond cooling or curing, maximum performance can be assured, thus maximizing yield.
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As the component density of optical modules and their complexity increases – a vital trend necessary to ensure the future competitiveness of photonic solutions – the need for advanced automation in assembly becomes increasingly obvious. And in particular when hybrid integration with semiconductor electronics is required – where electronics manufacture is already a highly automated technology – automation of photonic device assembly is the only real way forward.
The photonic devices our machines assemble include silicon photonics components, (3D) sensor and LiDAR assemblies, photonics-enabled medtech devices, MEMS/MOEMS, miniature lasers, HPLDs and fiber pump modules, hybrid assemblies, LED print heads, high-power LEDs, optical communication devices, and many more.
Have a device type that is not listed? Get in touch:
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Key features
Passive/active high-precision alignment
High-precision bonding accuracy
Flip-chip position-&-attach
Chip-on-Submount (CoS)
Hybrid integration, fiber alignment & pigtailing
Optical element assembly into packages
Simultaneous alignment of two optical elements
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High-precision positioning systems
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Fast 6-axis dual align-&-attach In-package align-&-attach
Rapid passive chip alignment Custom test probe heads
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Laser to waveguide using flip-chip assembly
Pick-&-place & handling sub-systems
Die sorting and component tracking
Welding, soldering, or (UV) epoxy bonding
Adjustable bond force
Process parameter sequencing & tracking
Acquisition of operating parameters into a database
OCR for serial number tracking and component traceability
Simultaneous alignment of two optical elements
Fiber array attachment
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Complex micro-optical assembly
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Vacuum pick-up tools
Relevant machine types:
ASSEMBLYLINE, FIBERLINE, BONDLINE, CUSTOMLINE
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Photonic Device Assembly (in-line), A1200
ASSEMBLYLINE
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Fiber-Optic Assembly, incl. F300
F300
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Photonic Device Assembly Cell (stand-alone), AL2000
