Wire Bonding Inspection; Test

Assembly Automation Technology - dedicated to pick&place, test, inspection and tape&reel processes

Die bonder, wire bonder, die attach tester, wire pull tester, ultrasound generator.

AI Vision Inspection, Ultrasonic ACF Bonding

automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).

automatic vision inspection that is dedicated to Semicon backend front of line operations. We have the world's first 3D inspection running in mass production.

Machine vision, system integration and software solutions in various industries such as semiconductor.

Display and semiconductor equipment.

Products used for dispensing adhesives, coatings, sealants, biomaterials and other materials; for fluid management; for test and inspection; and for UV curing and plasma surface treatment.

Wafer Bump & Wire Bonding 3D AOI, Wafer Bump 3D Vision Inspection, Scanning Electron Microscope, Conformal Coating Inspection System.

3D AOI machines for packaging, wire bonding and wafer inspection.

Post Wire Bond Inspection System, Virtual Assistance Control System (VASC). Machine vision.

Machine vision and related components developer for non-contact precision measurement and automatic optical inspection system (AOI) and automatic appearance inspection system (AVI)

Semiconductor, LED, PV inspection, testing and sorting solutions. Advance robotic solutions.

Bond testers and accessoires. Vibration control platform. Tools and Jigs.

AOI (Automatic Optical Inspection) Systems for lead frames, die, epoxy, wire and BGA.

Vison Inspection System, Wafer Measurement System, Wafer Handling System

Bond testing systems

Bond testers and die sorters

Post-bond inspection system, die coater, molding adhesion promoter station, cleaning station, vessel tanks

Wire bonders, bond testers.