Post Wirebond Inspection System - ISP5000V
High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
Key Features
Designed for Leadframe or substrate with strip size of 300mm x 100mm.
Dual magazine loader (input and output magazine)
Pusher and gripper mechanism with anti-jamming mechanism for leadframe handling.
Pneumatic clamps to firmly hold the leadframe during XY stage movement.
Automatic conversion accommodate different leadframe size.
Programmable centre support mechanism for warped leadframe.
High speed camera system with global shutter and stroboscopic control.
Cognex based image processing algorithms.
Defect mapping with re-callable image for verification.
Various reject identification module for selection.
Optional SECS/GEM communication for strip map and recipe transfer.
Specification (PDF)
Post Wirebond Vision Inspection System - PWB1000V
High speed stereoscopic line-scanning 3D vision inspection system designed to meet the high throughput demand in semiconductor die-attach and wirebond inspection. Utilizing dual CCD line-scan camera system from Chromasens Germany, the integrated stereo optical assembly with factory pre-calibrated 3D algorithms ensuring consistent and accurate measurement at all time.
Key Features
Stereoscopic Line Scanning Camera system at 7300 pixel (Dual Sensor)
High Speed 3D Image Reconstruction with 5700 line per second.
Fast Scanning Speed of 75mm per seconds. (max at line rate 20kHz)
3D height map & color image simultaneously.
High Brightness LED illuminator with patented reflection technology.
Cognex Based Image Processing System.
Parallel Processing with Multiples PCs.
Multiple Magazine Loader.
Dual Scanning Track Mechanism eliminates waiting time.
Defect Classification base on Vision Tools.
Strip Mapping, 2D Matrix Code, SESC-GEM & etc
Specification (PDF)
Optical Inspection System
1st Optical Inspection System - WIS1000
Microscopy based wafer inspection system integrated with wafer autoloader, macro front and back inspection and micro-inspection with multiple objective lenses and selectable illumination technique like bright-field, dark-field and normaski interference contrast.
Key Features
Designed for 6" and 8" wafer inspection.
Automatic wafer loading and unloading with OCR reader.
Programmable XY stages with point-and-shoot wafer alignment algorithms.
Wafer Mapping and simple defect classification.
Anti-vibration platform ensuring good images during micro inspection.
Ergonomic design based on SEMI S2/S8 requirement.
Optional Inking module for Reject Identification
Optional SECS/GEM communication for wafer map and recipe transfer
Specification (PDF)
2nd Optical Inspection System - DIS8000
DIS8000 is designed to handle frame wafers post wafer dicing process. It is able to inspect defects that are observable prior to dicing and also die defects resulted post dicing process. It’s equipped with two types of defect identification methods, inking on the defective die and wafer map containing locations of the defective
die with classification. The system is capable of performing wafer backside inspection.
Key Features
Designed for 8" & 12" wafer mounted on dicing frame.
Programmable framed wafer magazine loader.
Grip & Push handling mechanism for framed wafer.
Barcode reader for wafer map retrieval from host.
Point-and-shoot wafer alignment method.
Micro-optics with bright-field, dark-field and normaski interference contract illuminations.
Motorized objective lens ranging from 5x to 100x objectives.
Die inking reject identification module with wafer map.
Optional back side inspection module.
Optional SECS/GEM communication module.
Specification (PDF)
3rd Optical Inspection System - ISP3100
ISP3100 is designed to handle lead frames or substrates for visual inspection and yield management after die attach and wire bonding process. It’s equippedwith strip mapping system and auto-conversion mechanism for
different types of packages. It’s capable to perform physical marking with various types of reject identification module such as puncher, wire breaker, bristle, scriber, inker, laser wire breaker and laser clip bond cutter.
Key Features
Designed to handle leadframe or substrate size of max. 300x100mm
Auto-conversion module for leadframe package changeover without manual adjustment.
Pusher & Gripper with anti-jamming mechanism.
Pneumatic clamps to hold leadframe into position during stage movement.
Programmable center support rail for warped leadframe.
User friendly HMI with strip mapping control.
Various reject marking module for selection. (inker, scriber, bristle, puncher, wire breaker, laser cutter and etc.)
Optional SECS/GEM communication module.
Wafer Thickness Measurement System - MPT1000
OEM Products
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by QES Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
Key Features
Thickness resolution (0.1um) providing uniform TTV for production control of wafers.
Measurements after back grind or dicing provides flexibility for thickness uniformity control.
Small focused laser spot (1 um) provides the resolution required for measuring bumped wafers and via features.
Wafer Sorting System - WHS2200B
Designed for wafer sorting between cassettes. Use of Hirata Dual Arm ATM Robot with 4 load ports design. Accept 6" & 8" Open Cassettes. Integrated with Wafer Alignment and OCR reader module.
Key Features
For 6" & 8" Wafers
Various sorting method and customization according to requirement.
4x universal Load ports for 6" and 8" open cassette without conversion.
Cassette Slot Mapping function integrated.
Wafer Notch and OF Alignment module.
IOSS OCR Reader.
SECS/GEM interface for mapping & recipe file transfer host computer.
Specification (PDF)
Wafer Packing System - WHS3200
Designed for automatic wafer transfer between shipping carriers (canister, wafer jar and etc) and semi standard open cassettes.
Key Features
For 6" & 8” Wafers
3x Open Cassettes Station Split & Merge Lot between cassettes.
3x Wafer Carrier Station (2x for canister, 1x for Wafer Jar)
Built-in Hirata Wafer Pre-Aligner (6 & 8” wafers)
IOSS or Cognex OCR Reader
ATM Robotic Arm with Flip Axis (Optional Dual Arm)
Built-in color sensor for wafer, interleave paper or spacer detection.
Built-in height sensor on Canister Port for accurate robotic handling.
Optional vision sensor for wafer breakage detection.
Optional non-contact wafer handling (cyclone or bernoulli technique)
Optional SESC-GEM Interfaces
Number of Load Port can be customized.
Specification (PDF)
Wafer Sorting System - WHS8000
Designed for wafer sorting between cassettes. Accept FOUP, FOSB and 8" & 12" Open Cassettes. Integrated with Wafer Alignment and OCR reader module for wafer orientation return position and wafer ID mapping data file according to lot info.
Key Features
For 8" & 12" Wafers
Various sorting method and customization according to requirement.
2x FOUP ports, come with 8" open cassette adapter.
Cassette Mapping function integrated.
Wafer Notch Alignment module.
IOSS or Cognex OCR Reader.
SECS/GEM interface for mapping & recipe file transfer host computer.
Specification (PDF)
Wafer ID Labeling System - DHS8000
Designed for automatic reading of OCR or matrix code from the wafer that is mounted on the dicing frame, then generate and print-out barcode label sticker and affix it on the dicing film. This is to ensure lot traceability after wafer dicing process as OCR code might be damaged after dicing.
Key Features
For 8" & 12" Wafer mounted on Dicing Frame.
Load/Unload station for frame wafer metal cassette.
Auto-conversion module for switching between 8" and 12" wafer.
Programmable Wafer ID reading position.
IOSS or Cognex OCR reader.
Barcode Printer to generate sticker according to OCR information.
Sticker Dispensing module to affix barcode sticker on to dicing film or frame.
Optional SECS/GEM interface for data and recipe control over host computer.
Specification (PDF)
Batch Wafer ID Reader - WHS150R
Designed for automatic in-cassette reading of OCR & matrix code on wafer. All wafers in the cassette will be read in sequential manner. Built in mapping sensor module to skip reading of empty slot and Wafer Flat alignment module for programmable OCR reading position and wafer orientation return position in the cassette.
Key Features
For 6” Wafer
1x Open Cassettes Station
Cassette Orientation Sensors (detect reverse placement of cassette)
Cassette “Present” and “Tilt Sensors.
In-Cassette Wafer Mapping Function
Wafer Orientation Flat Alignment mechanism integrated.
Programmable Wafer Rotation for various Wafer ID locations.
Batch Wafer ID Reading (Front & Back also wafer ID on Orientation Flat area)
Recipe Controlled mapping, alignment & Wafer ID reading.
IOSS OCR Reader
Signal Light Bar for Operation Status (Red, Yellow, Green and Blue)
Cassette Map File with xml format.
Multi Touch Panel PC & Windows Base GUI
Optional SESC-GEM Interfaces
Specification (PDF)
Batch Wafer Transfer System - WHS300G
Designed for wafer transferring, splitting, merging or Flipping of wafer from the input cassette to the output cassette in batch mode. Accommodates SEMI standard open cassette with 26-slot, 25-slot and 13-slot. There are four load ports available for transfer of wafer between cassettes.
Key Features
For 8" Wafers
4x Open Cassette Station, split & merge lot between cassettes.
Wafer Notch Alignment.
Wafer Mapping, cross slot and double wafer detection.
Multi-axes Linear Motion for handling of wafers.
Recipe controlled operation
Optional SECS/GEM communication with host computer system.
Specification (PDF)
Strip Handling System
Strip ID Laser Marking System - LSI1000
Designed for Laser Marking of Strip ID (2D Matrix Code) on incoming leadframe or substrate. It’s also equipped with lead orientation checker, post mark quality check station and post mark cleaning station with air blower.
Key Features
For Leadframe/Substrate Stacked Magazine loading and unloading.
Dual Pick and Place Pneumatic arms at load and unload station.
Handling of interleave papers.
Linear Motor slider for indexing to mark, inspection and cleaning stations.
Leadframe and Substrate orientation checker.
Laser Marker selection according to customer preferences.
2D Matrix Reader for matrix code inspection after marked.
Blower station for cleaning of particle generated during marking process.
Reject Station for defective strip after marked.
TCPIP interface to Strip Map Server to ensure unique Strip ID.
Optional SECS/GEM Interface.
