Package Inspection; Lead Scanners

Assembly Automation Technology - dedicated to pick&place, test, inspection and tape&reel processes

FSH (Flying Over Scanning Holography) Module, Scanner, AOI System

Dispenser, Vision Dispenser, Cabinet Vision Dispenser, Piezo Jet Valve, Wafer Reinforcement, ASIC Encapsulation, Solder Paste, Wafer Underfill, Smart Production Line, Micro Spot Soldering, Soldering Machine

BEOL semiconductor equipment: laser marking, wafer inspection, wafer jet deflashing systems, tape and reel machines. Test handlers, pick and place inspection, trim/sort machines,

Dicing saws, Ball, Bump, Burr AOI

Backend Semicon Equipment: Saw and Place, Pick and Place, L/F loader, Trim/Form/Singulation, Strip/Wafer Mount System, Wafer Taping/Detaping System, Cam Press Trim/Form System. Vision Inspection Systems, Inline Assy System, Ultrasonic Welding System.

AI Vision Inspection, Ultrasonic ACF Bonding

automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).

automatic vision inspection that is dedicated to Semicon backend front of line operations. We have the world's first 3D inspection running in mass production.

Machine vision, system integration and software solutions in various industries such as semiconductor.

Display and semiconductor equipment.

Systems for nondestructive inspection of bonded wafers and packaged semiconductor

Wafer Bump & Wire Bonding 3D AOI, Wafer Bump 3D Vision Inspection, Scanning Electron Microscope, Conformal Coating Inspection System.

3D AOI machines for packaging, wire bonding and wafer inspection.

Semiconductor equipment: Test Handler, Vision Inspection, Automation, Laser App. System, Flip Chip Handler, Die Attach System.

automated optical and X-ray inspection system for printed circuit board assemblies (PCBA), semiconductor package, or power module

3D Solder Paste Inspection System, 3D Semiconductor Inspection System, 3D Automated Optical Inspection System, 3D SPI, 3D AOI, Smart Factory and Artificial Intelligence

Machine vision and related components developer for non-contact precision measurement and automatic optical inspection system (AOI) and automatic appearance inspection system (AVI)

Assembly/Hybrid Equipment: Flip Chip, Cleaning Equipment, Automation & Robotics, TAB Tools, Pick & Place, Marking Machines/Imprinting, Chip taping. FLAT PANEL DISPLAY (FPD): Tape Automated Bonding. Test: Handlers/Positioners.

IC chip test handler, wafer and reel AOI, CMP pad metrology in-situ monitor. Glass gringing, chmfering machine for FPD, automatic edge coating sysyem for FPD.