Autowafer Pro™: Ultrasonic Equipment for NDT of Bonded Wafers
ultrasonic equipment
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
Software options
Transducer options
Product Details:
A flexible, automated wafer inspection system designed for production, AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers. It’s the ideal ultrasonic equipment for identifying bond defects in wafer applications such as MEMS, BSI Sensors, CMOS, memory, TSV and LED.
With extensive analysis capabilities at both the wafer and device level, there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling, AutoWafer Pro supports 100% nondestructive testing (NDT) for improved yields and a faster time to market.
The ideal ultrasonic equipment for detecting wafer-to-wafer bonding defects
A fully automated, production-ready wafer inspection system for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller
Provides wafer map with die-level pass/fail indicators (optional)
Provides analysis (optional)
200mm SECS/GEM
TSV entrenched metrology
Fast, high-resolution scanning of 200mm and 300mm wafers for production environments
Fully automated robotics using open cassettes, SMIF Pod, FOUPs or FOSB handling
Class 1 clean room compliant, with integrated HEPA filter
300mm SECS/GEM (optional)
KLARF compatible (optional)
Autowafer™: Automatic Ultrasonic Testing for Bonded Wafers
automatic ultrasonic testing
Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.
Software Options
Transducer Options
Product Details:
AutoWafer is an ultrasonic wafer scanner for nondestructive testing (NDT) of wafers in development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects.
The ideal automatic ultrasonic testing system for detecting wafer-to-wafer bonding defects
A fully automated, production-ready wafer scanner for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller
Provides wafer map with die-level pass/fail indicators (optional)
Provides analysis (optional)
200mm SECS/GEM
TSV entrenched metrology
Transducers for AutoWafer and AutoWafer Pro
Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations:
Sonix S-series ultrasonic NDT transducers are designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. We offer the collaborative expertise to help customers choose the best ultrasonic NDT transducer for their application, based on three primary considerations:
Resolution: Spatial resolution determines the smallest features and defects customers can see in x-y dimensions. Depth resolution determines the thinnest layers that can be resolved. Both spatial and depth resolution improve with increasing frequency. However, there’s a tradeoff between frequency and penetration. The goal is to choose a frequency sufficient to penetrate to and detect the defects customers are looking for.
Focal zone determines the depth of focus in the z dimension, or how many layers you can see clearly in a scan. Here, the tradeoff is that a deeper focal zone means lower spatial resolution. The goal is to pick the highest frequency that will penetrate to the interface of interest, such as TSVs, while providing optimal resolution.
Focal length determines the depth of penetration within the silicon where resolution and focus are at their maximum.
Sonix Transducers
Designed in-house. Sonix designs its own transducers, optimizing spatial and depth resolution for the best possible imaging on actual samples of the devices our customers manufacture. A generic transducer simply can’t match Sonix image quality.
Wide frequency range. We offer more than 40 transducers from 15MHz to 300MHz, covering the full range of frequencies required in microelectronic manufacturing.
Robust construction. Sonix transducers are designed to withstand the demands of nonstop operation in high-throughput production environments.
S-series transducers. Sonix’s advanced transducers incorporate proprietary technology to improve signal sensitivity and spatial resolution, reduce delay line reflections and provide more robust performance.
ECHO VS™ Ultrasonic NDT Equipment
NDT Equipment
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision.
Software options
Transducer options
Product Details:
To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications, ECHO VS includes standard features such as heated water for optimum acoustic coupling, Flexible TAMI for efficient capture of the most useful data, Waveform Averaging for an improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate ultrasonic NDT equipment for molded flip chip, CSP, MCM, stacked die, MUF and other advanced packaging technologies.
Detects air defects as thin as 0.01 micron and spatially resolves defects down to 5 microns.
Image Enhancement Suite with heated water, waveform simulation and other innovations for industry-leading image quality in advanced packaging applications
Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
Waveform averaging for improved signal-to-noise ratio
Transducers from 15MHz through 300MHz, designed and matched in-house to address all types of applications and materials
Stacked Die Imaging (SDI) (optional)
Molded Flip Chip Imaging (MFCI)
ECHO™ Ultrasonic Flaw Detector
Ultrasonic Flaw Detector
The ECHO scanning acoustic microscope is a nondestructive ultrasonic flaw detector designed to simplify testing, increase yield and maximize productivity in the lab or on the production floor.
Software options
Transducer options
Product Details:
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
A robust, universal, ultrasonic flaw detector for overmolded single-die packages, bare flip chips and other standard applications
Imaging of defects as small as 10 microns
Transducers from 15MHz through 200MHz, designed and matched in-house to address all types of applications and materials
Stacked Die Imaging (SDI) (optional)
Molded Flip Chip Imaging (MFCI) (optional)
ECHO Pro™ Ultrasonic NDT System
Ultrasonic NDT equipment
ECHO Pro is a next-generation scanning acoustic microscope solution that adds fully automated JEDEC tray handling to the ECHO platform. This robust, high-performance ultrasonic NDT system is designed for 100% inspection and maximum throughput in high-volume, low-mix production environments.
Software options
Transducer options
Product Details:
Using the reputable and reliable ECHO scanning acoustic microscope as the base system, Sonix has incorporated industry-standard SMEMA input and output handlers for easy integration of ultrasonic NDT equipment into the production line. Our advanced patent pending pick-and-place gantry and drying process enable high-speed productivity with no-touch operation for 24/7 production.
The next generation in non-destructive testing equipment, with fully automated JEDEC tray handling for high-volume, low-mix production environments
Industry-standard SMEMA input and output handlers
Patent pending pick-and-place process designed for optimum part handling, decreased drying time and dramatically higher throughput
Stacked Die Imaging (SDI)
Molded Flip Chip Imaging (MFCI)
